Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/67729
標題: Adlayer structure and copper deposition of a Au(111) electrode modified by bis(3-sulfopropyl) disfulride and mercaptopropylsulfonic acid
作者: Cheng, T.Y.
Yang, Y.C.
Dow, W.P.
Lee, Y.L.
期刊/報告no:: Abstracts of Papers of the American Chemical Society, Volume 233.
URI: http://hdl.handle.net/11455/67729
ISSN: 0065-7727
Appears in Collections:期刊論文

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