Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/70464
標題: Publisher's Note: Microvia Filling by Cu Electroplating over a Au Seed Layer Modified by a Disulfide J. Electrochem. Soc., 156, D155 (2009)
作者: Dow, W.P.
Chiu, Y.D.
Yen, M.Y.
關鍵字: copper
electroplated coatings
gold
surface treatment
期刊/報告no:: Journal of the Electrochemical Society, Volume 156, Issue 6, Page(s) S7-S7.
URI: http://hdl.handle.net/11455/70464
ISSN: 0013-4651
文章連結: http://dx.doi.org/10.1149/1.3117562
Appears in Collections:期刊論文

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