Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/70650
標題: Stress evolution in Co/Ti/Si system
作者: Guo, S.S.
Chu, Y.C.
Tsai, C.J.
關鍵字: thin films
cobalt silicides
interlayer
insitu strain-measurements
oxide-mediated epitaxy
single-crystal
cosi2
tisi2 thin-films
cobalt silicide
mu-m
reactive deposition
interface roughness
growth
si
期刊/報告no:: Materials Chemistry and Physics, Volume 88, Issue 1, Page(s) 71-76.
摘要: The total force per unit width (F/W) in the film during isochronal annealing of the Co/Si and Co/Ti/Si systems were measured using a laser scanning method for substrate curvature measurements. During isochronal annealing of the sample at a ramp rate of 5degreesC min(-1), several abrupt changes of F/W were observed. The correlation between the phase transformation of cobalt silicides and the abrupt changes of F/W was found. For these two systems, formation of Co2Si and transition of Co2Si to CoSi induce compressive changes in F/W, while transformation of CoSi to CoSi2 induces tensile changes in F/W. With Ti interlayer increasing from 0 to 9 nm, the CoSi2 formation temperature is raised from 509 to 673degreesC and the magnitude of the maximum change in F/W is reduced from 160 to 80 N m(-1) (C) 2004 Elsevier B.V. All rights reserved.
URI: http://hdl.handle.net/11455/70650
ISSN: 0254-0584
文章連結: http://dx.doi.org/10.1016/j.matchemphys.2004.06.011
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