Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/70704
標題: Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging
作者: Suga, T.
Song, J.M.
Lai, Y.S.
期刊/報告no:: Microelectronics Reliability, Volume 52, Issue 2, Page(s) 301-301.
URI: http://hdl.handle.net/11455/70704
ISSN: 0026-2714
文章連結: http://dx.doi.org/10.1016/j.microrel.2011.12.015
Appears in Collections:期刊論文

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