Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/70705
標題: Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints
作者: Song, J.M.
Liu, Y.R.
Lai, Y.S.
Chiu, Y.T.
Lee, N.C.
關鍵字: au/ni surface finish
chip-scale packages
lead-free solders
ag-cu
solders
intermetallic compounds
interfacial reactions
drop test
evolution
nanoindentation
microstructure
期刊/報告no:: Microelectronics Reliability, Volume 52, Issue 1, Page(s) 180-189.
摘要: In this work, we present ball impact test (BIT) responses and fracture modes obtained at an impact velocity of 0.8 m/s on SAC (Sn-Ag-Cu) package-level solder joints with a trace amount of Mn or RE (rare earth) additions, which were bonded with substrates of OSP Cu and electroplated Ni/Au surface finishes respectively. With respect to the as-mounted conditions, the Ni/Au joints possessed better impact fracture resistance than those with Cu substrate. Subsequent to aging at 150 degrees C for 800 h, multi-layered intermetallic compounds emerged at the interface of the Ni/Au joints and gave rise to degradation of the BIT properties. This can be prevented by RE doping, which is able to inhibit the growth of interfacial IMCs during aging. As for aged Cu joints, the Mn-doped samples showed the best performance in impact force and toughness. This was related to the hardened Sn matrix, and most importantly, a greater Cu3Sn/Cu6Sn5 thickness ratio at the interface. Compared to Cu6Sn5, Cu3Sn with a similar hardness but greater elastic modulus possessed better plastic ability, which was beneficial to the reliability of solder joints suffering high strain rate deformation if no excess Kirkendall voids formed. (C) 2011 Elsevier Ltd. All rights reserved.
URI: http://hdl.handle.net/11455/70705
ISSN: 0026-2714
文章連結: http://dx.doi.org/10.1016/j.microrel.2011.09.003
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