Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/71255
標題: Retarding the Cu5Zn8 phase fracture at the Sn-9 wt.% Zn/Cu interface
作者: Wang, J.Y.
Lin, C.F.
Chen, C.M.
期刊/報告no:: Scripta Materialia, Volume 64, Issue 7, Page(s) 633-636.
摘要: Cu5Zn8 phase was formed at the Sn-9 wt.% Zn/Cu interface after reflow, but this phase fractured very severely during subsequent solid-state annealing. By reducing the cooling rate of the reflow process, a thicker Cu5Zn8 phase was formed and the phase fracture was retarded during subsequent annealing, which retained the integrity of the Cu5Zn8 phase at the interface. The improvement in the Cu5Zn8 phase integrity was attributed to the maintenance of a local equilibrium at the interface. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI: http://hdl.handle.net/11455/71255
ISSN: 1359-6462
文章連結: http://dx.doi.org/10.1016/j.scriptamat.2010.12.006
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