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|標題:||An Efficient Metal-Core Printed Circuit Board Witha Copper-Filled Through (Blind) Holefor Light-Emitting Diodes|
|關鍵字:||Light-emitting diodes (LEDs), packaging|
|摘要:||A Cu-filled through (blind) hole was formed in ametal-core printed circuit board (MCPCB) by drilling a holeunderneath the chip pad, followed by hole filling using copperelectroplating. This Cu-filled through (blind) hole acts as a superiorheat-dissipation route, which directly and efficiently removesthe heat generated by the light-emitting diode (LED) chip. Comparedwith a conventional MCPCB, the MCPCB with a Cu-filledthrough (blind) hole significantly reduces the peak surface temperatureof the LED chip from 46 ◦C to 39 ◦C and the total thermalresistance from 8.9 to 2.8 K/W.|
|Appears in Collections:||化學工程學系所|
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