Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/84836
標題: An Efficient Metal-Core Printed Circuit Board Witha Copper-Filled Through (Blind) Holefor Light-Emitting Diodes
關鍵字: Light-emitting diodes (LEDs), packaging
thermal resistance
摘要: A Cu-filled through (blind) hole was formed in ametal-core printed circuit board (MCPCB) by drilling a holeunderneath the chip pad, followed by hole filling using copperelectroplating. This Cu-filled through (blind) hole acts as a superiorheat-dissipation route, which directly and efficiently removesthe heat generated by the light-emitting diode (LED) chip. Comparedwith a conventional MCPCB, the MCPCB with a Cu-filledthrough (blind) hole significantly reduces the peak surface temperatureof the LED chip from 46 ◦C to 39 ◦C and the total thermalresistance from 8.9 to 2.8 K/W.
URI: http://hdl.handle.net/11455/84836
Appears in Collections:化學工程學系所

文件中的檔案:

取得全文請前往華藝線上圖書館



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.