Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/84874
標題: Surface Metallization of Polyimide as a Photoanode Substratefor Rear-Illuminated Dye-Sensitized Solar Cells
摘要: Plastic film is promising as a photoanode substrate of dye-sensitized solar cell (DSSC) for flexible applications, while a lowtemperaturesintering process is generally adopted for the TiO2 mesoporous film due to unstable thermal property of general plastics.This study demonstrates that typical high-temperature TiO2 sintering can be adopted for preparing the photoanode when using asurface-metallized polyimide (PI) film. A Sn/Ni bi-layer is formed on a PI film via a chemical process as the conductive layer. TheSn/Ni-coated PI photoanode can withstand high-temperature TiO2 sintering at a peak temperature of 430◦C for 30 min withoutsignificant visual deformation due to high thermal stability of PI and strength reinforcement caused by surface metallization. TheDSSC employing the Sn/Ni-coated PI film as the photoanode substrate reaches an energy conversion efficiency of 3.44% under1 sun rear-side illumination.
URI: http://hdl.handle.net/11455/84874
文章連結: http://dx.doi.org/10.1149/2.046309jes
Appears in Collections:化學工程學系所

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