Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/86191
標題: Effect of polyimide baking on bump resistance in flip-chip solder joints
作者: Cheng, Hsi-Kuei
Feng, Shien-Ping
Lai, Yi-Jen
Liu, Kuo-Chio
Wang, Ying-Lang
Liu, Tzeng-Feng
Chen, Chih-Ming
URI: http://hdl.handle.net/11455/86191
ISSN: 00262714
Appears in Collections:化學工程學系所

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