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標題: Effect of Temperature on Energy Loss and Internal Friction in Nanocrystalline Metal Thin Films
作者: Yu-Ting Wang
關鍵字: internal friction
copper thin film
energy loss
grain size
twin crystal
grain boundary
activation energy
internal friction peak
grain boundary diffusion
dislocation movement
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摘要: This study employed a temperature controlled capacitance-based system to measure the mechanical behaviors associated with temperature dependent energy loss in ultra-thin copper (Cu) films. Thin Cu films are widely used in electronic interconnections and micro-electromechanical systems (MEMS); however, most studies have focused on temperature-dependent dynamic properties at larger scales. This study designed a paddle-like test specimen with a Cu film deposited on the upper surface in order to investigate the real-time temperature-dependent mechanical properties of thin metal films at elevated temperatures of up to 160 °C under high vacuum conditions at very small scales. Real-time energy loss was measured according to the decay in oscillation amplitude of a vibrating structure following resonant excitation. Film thickness and grain size were closely controlled with respect to the dynamic properties of the films. It was also determined that the internal friction of ultra-thin metal films is strongly dependent on film thickness and temperature.
文章公開時間: 10000-01-01
Appears in Collections:精密工程研究所



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