Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/94706
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dc.contributor.authorHsin-Yu Wuzh_TW
dc.contributor.authorChia-Hsun Hsuzh_TW
dc.contributor.authorShui-Yang Lienzh_TW
dc.contributor.authorYeu-Long Jiangzh_TW
dc.contributor.author江雨龍zh_TW
dc.date2016-11-22-
dc.date.accessioned2018-02-06T06:25:13Z-
dc.date.available2018-02-06T06:25:13Z-
dc.identifier.urihttp://hdl.handle.net/11455/94706-
dc.description.abstractIn this study, metal films are fabricated by using an in-line reactive direct current magnetron sputtering system. The aluminum–titanium (AlTi) back contacts are prepared by changing the pressure from 10 mTorr to 25 mTorr. The optical, electrical and structural properties of the metal back contacts are investigated. The solar cells with the AlTi had lower contact resistance than those with the silver (Ag) back contact, resulting in a higher fill factor. The AlTi contact can achieve a solar cell conversion efficiency as high as that obtained from the Ag contact. These findings encourage the potential adoption of AlTi films as an alternative back contact to silver for silicon thin-film solar cells.zh_TW
dc.language.isoenzh_TW
dc.relationEnergies 2016, 9(11), 975zh_TW
dc.subjectsilicon thin-film solar cellszh_TW
dc.subjectaluminum–titanium (AlTi) alloyzh_TW
dc.subjectcontact resistancezh_TW
dc.titleAluminum–Titanium Alloy Back Contact Reducing Production Cost of Silicon Thin-Film Solar Cellszh_TW
dc.typeJournal Articlezh_TW
dc.identifier.doi10.3390/en9110975zh_TW
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