Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/95623
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dc.contributor.authorPei-Yu Wuzh_TW
dc.contributor.authorChing-Hsuan Linzh_TW
dc.contributor.author陳志銘zh_TW
dc.contributor.authorChih-Ming Chenzh_TW
dc.date2017-05-25-
dc.date.accessioned2018-10-12T02:35:07Z-
dc.date.available2018-10-12T02:35:07Z-
dc.identifier.urihttp://hdl.handle.net/11455/95623-
dc.description.abstractNickel (Ni) metallization of polyimide (PI) was performed using a solution-based process including imide-ring opening reactions, the implanting of Ni ions, the reduction of catalytic Ni nanoparticles, and the electroless deposition of a Ni film. The start-up imide-ring opening reaction plays a crucial role in activating inert PI for subsequent Ni implanting and deposition. A basic treatment of potassium hydroxide (KOH) is commonly used in the imide-ring opening reaction where a poly(amic acid) (PAA) layer forms on the PI surface. In this study, we report that the KOH concentration significantly affects the implanting, reduction, and deposition behavior of Ni. A uniform Ni layer can be grown on a PI film with full coverage through electroless deposition with a KOH concentration of 0.5 M and higher. However, excessive imide-ring opening reactions caused by 5 M KOH treatment resulted in the formation of a thick PAA layer embedded with an uneven distribution of Ni nanoparticles. This composite layer (PAA + Ni) causes wastage of the Ni catalyst and degradation of peel strength of the Ni layer on PI.zh_TW
dc.language.isoen_USzh_TW
dc.publisherMETALSzh_TW
dc.relationMetals 2017, 7(6), 189zh_TW
dc.relation.urihttps://www.mdpi.com/2075-4701/7/6/189zh_TW
dc.subjectmetallizationzh_TW
dc.subjectNizh_TW
dc.subjectpolyimidezh_TW
dc.subjectinterfacial microstructurezh_TW
dc.subjectnanoparticlezh_TW
dc.titleStudy of Surface Metallization of Polyimide Film and Interfacial Characterizationzh_TW
dc.typeJournal Articlezh_TW
dc.identifier.doi10.3390/met7060189zh_TW
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