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|標題:||Suppression effect of Ni grain size on the Ni3Sn4 growth at the Sn/Ni interface|
|摘要:||Effect of Ni grain size on the formation and growth kinetics of intermetallic compounds at the Sn/Ni interface is studied. For a coarse-grained Ni foil, only the Ni3Sn4 phase is formed with a thickness of 28 μm after aging at 200 °C for 1000 h. For a Ni electroplated layer with a fine-grained microstructure, the Ni3Sn4 phase grows at a very sluggish rate and its thickness is only 5 μm in the same reaction condition. The suppression effect on the Ni3Sn4 growth is attributable to the diffusion barrier effect of a thin Ni3Sn2 phase formed on the Ni electroplated layer.|
|Appears in Collections:||化學工程學系所|
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