Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/95624
標題: Suppression effect of Ni grain size on the Ni3Sn4 growth at the Sn/Ni interface
作者: Yu-Chen Tseng
Hsuan Lee
Shan-Chen Tsai
Yee-Wen Yen
陳志銘
Chih-Ming Chen
關鍵字: Electroplating
Soldering
Intermetallic compounds
Nickel
出版社: MATERIALS CHARACTERIZATION
摘要: Effect of Ni grain size on the formation and growth kinetics of intermetallic compounds at the Sn/Ni interface is studied. For a coarse-grained Ni foil, only the Ni3Sn4 phase is formed with a thickness of 28 μm after aging at 200 °C for 1000 h. For a Ni electroplated layer with a fine-grained microstructure, the Ni3Sn4 phase grows at a very sluggish rate and its thickness is only 5 μm in the same reaction condition. The suppression effect on the Ni3Sn4 growth is attributable to the diffusion barrier effect of a thin Ni3Sn2 phase formed on the Ni electroplated layer.
URI: http://hdl.handle.net/11455/95624
文章連結: https://www.sciencedirect.com/science/article/pii/S1044580316306842
Appears in Collections:化學工程學系所

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