Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/97174
標題: 封裝模壓製程之參數最佳化設計
Parameter Optimization Design of Packaging Molding Process
作者: 江坤煜
Ku-Yu Chiang
關鍵字: IC封裝
壓模製程田口實驗法
反應曲面法
IC package
compression molding process
Taguchi method
Response surface methodology
引用: 參考文獻 [1] 余峻瑜譯,基礎統計學初版(Modern Elementary Statistics),全華科技圖書股份有限公司,民國93年。 [2] 張瑞慶譯,非傳統加工,高立圖書,民國84年。 [3] 張豐程,“IC封裝製程中影響銲線品質之參數最佳化研究” 碩士論文,國立高雄第一科技大學機械與自動化工程系 ,2003。 [4] 徐業良,工程最佳化設計,宏明圖書有限公司,民國84年。 [5] 葉怡成,實驗計劃法-製程與產品最佳化,五南圖書出版股份有限公司,民國90年。 [6] 詹長岳,“金屬走線於模壓樹脂晶圓級封裝之研究” 碩士論文,國立彰化師範大學機電工程學系機電工程碩士班,2012。 [7] 紀博竣,“結合田口實驗法與反應曲面法於射出成型參數最適化之研究” 碩士論文,建國科技大學機械工程系暨製造科技研究所,2013。 [8] 黃炳耀,“應用田口方法於改善IC封裝製程翹曲之研究” 碩士論文,國立雲林科技大學工業工程與管理研究所,2011。 [9] 朱言主, “IC封裝模具黏模效應之研究” 碩士論文,國立成功大學工程科學研究所 ,2001。 [10] 孫志強,精密射出成形技術,塑膠世界雜誌社,1997。 [11] M. Yuki, Shimodate Works Epoxy molding Compound Development Dept., Hitachi Chemical Co. Ltd. [12] B. A. Chapman, H. D. DeFord, G. P. Wirtz and S. D. Brown, in: Technology of Glass, Ceramic, or Glass-Ceramic to Metal Sealing, W. E. Moddeman, C. W. Merten and D. P. Kramer(Eds), MD-Vol. 4,pp. 77-87. American Society of Mechanical Engineers, New York, 1987. [13] Myers, R. H., Montgomery, D. C.,” Response Surface Methodology: Process and Product Optimization Using Designed Experiments, 2nd edition, John Wiley and Sons”, New York, NY, 2002. [14] L. S. Turng, M. Peic, D. K. Bradley, “Process Simulation and Optimization for Injection Molding :Experimental Verification and Field Application”, Journal of Injection Molding Technology, Vol.6, No. 2, p.143-155, 2002. [15] E. Wiklund, and P. S. Wiklund, “Widening the six sigma concept: An approach to improve organizational learning”, Total Quality Management, 13, 2, pp.233-239. [16] R. S. Kenett, S. Zacks,”Modern Industrial Statistics with applications in R, MINITAB and JMP Second Edition”, 2014 [17] M. S. Phadke, “Quality engineering using robust design,AT&T Laboratories”, 1989。 [18] R. L. Frutiger, “The Effect of Flow on Cavity Surface Temperatures in Thermose t and Thermoplastic Injection Molding,” Ploym. Eng. Sci., 26, 243-254, 1986. [19] C. C. Lee and C. L. Tucker III, “Flow and Heat Transfer in Compression Mold Filling,” J. Non-Newtonian Fluid Mech., 245-264, 1987. [20] I. Ko, Y. Ki, “Effect of Postmold Curing on Plastic IC Packaging Reliability, ” Journal of Applied Polymer Science, Vol. 69, pp2187-2193 ,1998. [21] V. H. Kenner, B. D. Harper, and V. Y. Itkin, “Stress Relaxation in Molding Compounds,” Journal of Electronic Materials, Vol. 26, No. 7, pp.821-826, 1997. [22] G. Taguchi, “Quality Engineering in Japan”, Bulletin of the Japan Society of Precision Engineering, Vol.19, No.4, p.237-242, 1985. [23] D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Bressers, X.J. Fan, “Prediction of Process-Induced Warpage of IC Packages Encapsulated with Thermosetting Polymers,” Electronic Components and Technology Conference, pp98-105, 2004. [24] K.M.B. Jansen, L. Wang, D.G. Yang, C. van’t Hof, L.J. Ernst, H.J.L. Bressers and G.Q. Zhang “Constitutive Modeling of Moulding Compounds”, Electronic Components and Technology Conference, pp.890-894, 2004. [25] S.J. Chang and S.J. Hwang, “Design and Fabrication of an IC Encapsulation Mold Adhesion Force Tester,” IEEE Transaction on Electronics Packaging Manufacturing, vol. 26, no. 4, pp. 426-432, 1999. [26] “Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds,” STD. SEMI G69-0996, 1996. [27] http://www.towajapan.co.jp [28] http://www.yxlon.com [29] SAS Institute, 2013, JMP® 11 Design of Experiments Guide。
摘要: 近年來積體電路 ( Integrated Circuit,IC ) 朝向快速、多功能、高可靠度及外型輕、薄、短小的方向發展,隨著IC元件朝向高密度、高腳數且功能要求強大之趨勢發展的同時、模壓製程技術為現今封裝技術中,具有舉足輕重的角色。 因模壓封裝( Molding ) 為目前電子封裝中主要提供電路保護的方法之一,可使 IC 晶片封裝基板或導線架完成電路連線,以發揮電子訊息傳遞的功能,關鍵模壓製程對於良率的影響是非常重要,影響此製程品質因子為射出速度(Transfer Time)、射出壓力(Transfer pressure)、合模壓力(Clamp Pressure)、模溫(Mold Temperature)、預熱時間(Preheart Time)。 本研究以田口實驗法及反應曲面法最佳化製程參數,並利用信號雜音比 ( Signal to Noise Ratio ; S/N比 ) 之分析,找出製程最佳參數。實際實驗驗證此二方法皆可達成最佳之製程參數設計,改善製程之穩健性。
In recent years, Integrated Circuits (IC) have been developed to be fast, versatile, highly reliable, light-weight, thin and short. With the trend of high density, high pin count and strong function requirements of IC devices At the same time, the molding process technology for today''s packaging technology, has a pivotal role. Molding is one of the main methods for providing circuit protection in electronic packaging currently. The circuit board can be connected to an IC chip package substrate or a lead frame to exert the functions of electronic messaging and influence of the key molding process on the yield is very important. The quality factors affecting the manufacturing process are Transfer Time, Transfer Pressure, Clamp Pressure, Mold Temperature and Preheart Time. In this study, the Taguchi experimental method and the reaction surface method were used to optimize the process parameters, and the signal to noise ratio (S / N ratio) analysis was used to find the optimal process parameters. The actual experimental verification of these two methods are the best process parameters to achieve design, improve the robustness of the process.
URI: http://hdl.handle.net/11455/97174
文章公開時間: 2019-12-01
Appears in Collections:機械工程學系所

文件中的檔案:

取得全文請前往華藝線上圖書館



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.