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Investigation of Shear Strength for the Microbump of Advanced Packages under Temperature Loads
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The development of technology is miniaturization and lightweight, and the scale of the package has gradually narrowed to the micron level. In recent years, the flip chip structure has developed the copper pillar bump structure from the traditional solder ball, due to the copper pillar bump has a higher density than solder ball in the same area, and copper pillar bump's height can be controlled easilier. Therefore, the copper pillar bump has begun to be mass-produced afterwards. However, the strength of the solder joints in the package is very important for the reliability of the overall structure. One of the most important factors is temperature. Shear test is the most widely method to be used to evaluate solder joint strength. This study will explore the shear strength for the microbump under temperature loads. In this study, high temperature experiments and high temperature storage aging were performed at different temperatures. Due to the higher temperature, microbump's material will be soften, and the shearing force tends to be smaller. During high temperature storage aging, as the baking time increases, the residual stress of the copper pillar will be released, and enhance the strength of the bump at first, and then the strength decreases due to grain growth. Therefore, the shear force of the copper pillar first rises and then falls. In addition, this study also uses finite element analysis as the push ball simulation, and the stress and strain are concentrated on both sides of the pad.Thay's the weakest part of the whole structure. When the adhesive strength between the materials is weak, it will fracture from there. In order to save the development costs, finite element analysis can be used as a reference for future microbump structure design.
|Appears in Collections:||機械工程學系所|
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