Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/99255
標題: Light enhanced direct Cu bonding for advanced electronic assembly
作者: Sin-Yong Liang
Jenn-Ming Song
宋振銘
Shang-Kun Huang
Ying-Ta Chiu
David Tarng
Chih-Pin Hung
摘要: An innovative and efficient surface modification pre-treatment that enhances Cu–Cu direct bonding through electromagnetic irradiation, including pulsed Xenon flash and near infrared rays is proposed. Without vacuum, short but critical electromagnetic radiation exposure on faying faces prior to bonding can significantly improve the joint strength up to 50% or even more. Copper atom diffusion acceleration by increased compressive residual surface stresses resulting from sudden heating/cooling accounts for the joint reinforcement. A close relationship between the increase in joint strength and the change in surface physics properties due to electromagnetic irradiations can be found.
URI: http://hdl.handle.net/11455/99255
文章連結: https://link.springer.com/article/10.1007/s10854-018-9547-5
Appears in Collections:材料科學與工程學系

文件中的檔案:

取得全文請前往華藝線上圖書館



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.