Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/99257
標題: Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging
作者: Jenn-Ming Song
Sin-Yong Liang
Zong-Yu Xie
Po-Hao Chiang
Shang-Kun Huang
Ying-Ta Chiu
David Tarng
Chih-Pin Hung
Jing-Yuan Lin
關鍵字: MEMS packaging
Cu-to-Cu bonding
air plasma bombardment
formic acid vapor
摘要: To replace Al–Ge eutectic bonding, low-temperature direct Cu-to-Cu bonding was developed in this study. Lattice distortion and thus a hardened Cu subsurface conducted by air plasma bombardment, instead of surface activation, contributed to a compressive residual stress component and an accelerated Cu atom diffusion. This gave rise to a significant improvement in direct Cu bonding strength. Subjected to 3-min plasma exposure and the following deoxidation treatment using catalyzed formic acid vapor, robust Cu-to-Cu bonding with the joint strength up to 31.7 MPa can be achieved when bonded at 250 ℃ for 5 min under a loading pressure of 10 MPa in N2.
URI: http://hdl.handle.net/11455/99257
文章連結: https://myukk.org/SM2017/article.php?ss=1948
Appears in Collections:材料科學與工程學系

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