Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/99499
標題: 高頻軟性印刷電路板用低介電交聯型磷系聚醯亞胺及含氧二甲苯寡聚物之氧代氮代苯并環己烷合成與性質研究
Synthesis and characterization of low-dielectric crosslinkable phosphinated polyimides and oligo(phenylene oxide)s-containing benzoxazine for high-frequency communication.
作者: 李冠緯
Kuan-Wei Lee
關鍵字: 聚醯亞胺
環氧樹酯
活性酯
低介電
聚氧二甲苯
氧代氮代苯并環己烷
polyimide
epoxy resins
active ester
low-dielectric
phenylene oxide
benzoxazine
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摘要: 第一部份為以一鍋法製備磷系含羥基的雙胺單體1,並以一步溶液閉環法製備具有重複單元中含有羥基的磷系聚醯亞胺,本研究將重覆單元中的羥基分別以甲基丙烯酸酐 ( Methacrylic anhydride ) 和3-苯基-2-丙烯醯氯 ( Cinnamoyl chloride ) 進行酯化,將羥基取代成具活性酯基的Methacrylic結構 ( P3-MMA P4-MMA) 和 Cinnamoyl 結構 ( P3-cin和P4-cin ) 的聚醯亞胺。 同時,會將市售含羥基的雙胺單體,核心分別為CH3和CF¬3,並以一步溶液閉環法製備成含羥基的聚醯亞胺,再將羥基以甲基丙烯酸酐酯化 ( B4-MMA和F4-MMA ),討論並觀察核心結構的改變,對熱性質和介電性質的影響。   利用活性酯基與市售環氧樹脂HP7200進行固化,避免高極性二級醇生成,同時,氫鍵含量下降,固化後熱性質也會下降,因此本研究導入的 Methacrylic結構 和 Cinnamoyl 結構皆本身帶有C=C雙鍵,自身可進行交聯固化,使固化物擁有更高交聯密度,進而保有良好熱性質並提升介電性質。 第二部分為研究將市售的2,6二甲基苯醚結構的雙酚寡具物SA90 末段進行改質,先以親核取代後再氫化還原,合成出鄰位無甲基的二胺寡聚物,分別成功合成出末端具有Benzoxazine 結構的寡聚物和合成出主鏈型Polybenzoxazine,並與市售環氧樹酯HP7200在無催化劑下進行交聯固化,同時,Benzoxazine 結構可自身加熱開環交聯固化,使固化物擁有更高的交聯密度,進而提升熱性質,且相較於市售的SA90與市售環氧樹酯HP7200固化物,有較佳的熱性質和介電性質。
Part I. Synthesis and characterization of low-dielectric crosslinkable phosphinated polyimides for high-frequency communication. In the first part of this work, a phosphinated hydroxy diamine was prepared via a one-pot procedure. Based on the phosphinated hydroxy diamine, a series of polyimides with hydroxy linkage in the repeat unit was prepared by thermal imidization. The esterification of hydroxy unit with methacrylic anhydride and cinnamoyl chloride were performed to generate active ester-containing polyimides with methacrylic moiety ( P3-MMA and P4-MMA ) and cinnamoyl moiety ( P3-cin and P4-cin ) in the repeat unit. The other two other active ester-containing polyimides with methacrylic moiety ( B4-MMA and F4-MMA ) in the repeat unit were also prepared for property comparison. The active ester –containing polyimides with active ester act as epoxy harderner for a commercial epoxy resin, HP7200. Epoxy thermosets with high-Tg and moderate-to-low dielectric properties can be achieved. Part II. Synthesis and characterization of oligo(phenylene oxide)s-containing benzoxazine for high-frequency communication. In the second part of this work, a benzoxazine (BZSA90) and polybenzoxazine (PBZSA90) based on a amine-end capped oligo (2,6-dimethyl phenylene) (HSA90), which was prepared from the a phenol-end capped oligo (2,6-dimethyl phenylene) (SA 90). After self-curing or curing with epoxy resin (HP 7200), thermosets with high-Tg and very low dissipation factor can be obtained. Through comparing the data bwteen the BZSA90-cured epoxy thermoset and the SA90-cured epoxy thermoset, we found the Tg was significatnt enhanced, while the good dielectric properties can be maintained.
URI: http://hdl.handle.net/11455/99499
文章公開時間: 2020-07-28
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