Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/99500
標題: 高頻軟性印刷電路板用低介電聚醚醯亞胺合成與性質研究
Synthesis and characterization of low-dielectric Polyetherimide for high-frequency communication.
作者: 陳建翰
Chien-Han Chen
關鍵字: 聚醚醯亞胺
低介電
親核取代
去甲基
polyetherimide
low dielectric constant
nucleophilic substitution
demethylation
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摘要: 本實驗以具有第三丁基之單酚單體,分別與對二氟二苯砜(S-series)和十氟聯苯(F-series)進行親核取代(SNAr)得到單酚單體、之後進行去甲基(Demethylation)得到雙酚單體,再與4-氟硝基苯進行親核取代後再進行氫化還原(Hydrogenation)得到兩系列二胺單體。 接著將二胺單體與市售二酸酐以高溫閉環法製備聚醚醯亞胺。S-series擁有柔軟的核心,因此擁有較佳的有機溶解度,而F-series的核心較為剛硬,因此擁有較優異的玻璃轉移溫度,並且兩系列聚醯亞胺介電常數(Dk)皆可達到2.5以下。
Two novel aromatic diamines were successfully synthesized. In the first step, we synthesized two kinds of diol via nucleophilic substitution reaction of 3-tert-butyl-4-hydroxyanisole with bis(4-fluorophenyl)sulfone (S-series) and decafluorobiphenyl (F-series), respectively, followed by demethylation. After that, we used nucleophilic substitution reaction of diols with 4-fluoro-nitrobenzene, followed by catalytic reduction with hydrogen and Pd/C to form diamines. Both of them were used to prepare polyimides via thermal imidization with commercial aromatic dianhydride. S-polyimides are soluble in common organic solvents because of the flexible core. On the other hand, F-polyimides has a better glass transition temperature due to the rigid core. In addition, they shows excellent dielectric constant below 2.5.
URI: http://hdl.handle.net/11455/99500
文章公開時間: 2019-08-11
Appears in Collections:化學工程學系所

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