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DateTitleAuthor(s)File
12011Tailored Thermal and Mechanical Properties of Epoxy Resins Prepared Using Multiply Hydrogen-Bonding Reactive ModifiersLiu, J.K.; 林慶炫; Shau, S.M.; Juang, T.Y.; Chang, C.C.; Dai, S.H.A.; Su, W.C.; Lin, C.H.; Jeng, R.J.-
22011Preparation of Phosphinated Bisphenol from Acid-Fragmentation of 1,1,1-Tris(4-hydroxyphenyl)ethane and Its Application in High-Performance Cyanate EstersLin, C.H.; 林慶炫; Lin, H.T.; Tian, Y.W.; Dai, S.H.A.; Su, W.C.-
32011A reactive modifier that enhances the thermal mechanical properties of epoxy resin through the formation of multiple hydrogen-bonded networkJuang, T.Y.; 林慶炫; Liu, J.K.; Chang, C.C.; Shau, S.M.; Tsai, M.H.; Dai, S.H.A.; Su, W.C.; Lin, C.H.; Jeng, R.J.-
42008Fluorinated benzoxazines and the structure-property relationship of resulting polybenzoxazinesLin, C.H.; 林慶炫; Chang, S.L.; Lee, H.H.; Chang, H.C.; Hwang, K.Y.; Tu, A.P.; Su, W.C.; 張厚謙-
52009Benzoxazines with tolyl, p-hydroxyphenyl or p-carboxyphenyl linkage and the structure-property relationship of resulting thermosetsLin, C.H.; 林慶炫; Lin, H.T.; Chang, S.L.; Hwang, H.J.; Hu, Y.M.; Taso, Y.R.; Su, W.C.-
62009An approach to develop high-Tg epoxy resins for halogen-free copper clad laminatesLin, H.T.; 林慶炫; Lin, C.H.; Hu, Y.M.; Su, W.C.-
72010Facile, one-pot synthesis of phosphinate-substituted bisphenol A and its alkaline-stable diglycidyl ether derivativeLin, C.H.; 林慶炫; Chang, S.L.; Wei, T.P.; Ding, S.H.; Su, W.C.-
82008Facile Preparation of Novel Epoxy Curing Agents and Their High-Performance ThermosetsLin, C.H.; 戴憲弘; Lin, T.L.; Chang, S.L.; Dai, S.A.; Cheng, R.J.; Hwang, K.Y.; Tu, A.P.; Su, W.C.-
92010Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrateLin, C.P.; 陳志銘; Chen, C.M.; Lin, C.H.; Su, W.C.-

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