Browsing by Author 楊錫杭


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Issue DateTitleAuthor(s)Text
-Hexagonal microlens array modeling and fabrication using a thermal reflow processLin, C.P.; 楊錫杭; Yang, H.S.; Chao, C.K.-
-High fill-factor microlens array mold insert fabrication using a thermal reflow process楊錫杭; Yang, H.H.; Chao, C.K.; Wei, M.K.; Lin, C.P.-
-High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA processYang, H.; 楊錫杭; Chein, R.Y.; Tsai, T.H.; Chang, J.C.; Wu, J.C.; 簡瑞與-
-High-aspect-ratio microstructure filling by centrifugal force field modelingTsai, T.H.; 楊錫杭; Yang, H.; Chein, R.; 簡瑞與-
-Integrated electromagnetic microactuators with a large driving forcePan, C.T.; 楊錫杭; Yang, H.; Chou, M.C.; Shen, S.C.-
-Investigation and Comparison of Sliver Nanoparticles Deposition on Activated CarbonYi-Ping Wu; 吳一平
-LOW TEMPERATURE BIO-CHIP BONDING AND PACKAGING TECHNOLOGY楊錫杭; YANG, HSIHARNG; 吳孟諭; 程偉烜; WU, MENG YU; CHENG, WEI HSUAN-
-A low-temperature wafer bonding technique using patternable materials楊錫杭; Pan, C.T.; Yang, H.; Shen, S.C.; Chou, M.C.; Chou, H.P.-
-Micro-ball lens array fabrication in photoresist using PTFE hydrophobic effectShyu, R.F.; 蔡志成; Yang, H.; Tsai, W.R.; Tsai, J.C.; 楊錫杭-
-Micro-ball lens array modeling and fabrication using thermal reflow in two polymer layers楊錫杭; Yang, H.; Chao, C.K.; Lin, C.P.; Shen, S.C.-
-Micro-electroforming metallic bipolar electrodes for mini-DMFC stacks楊錫杭; Shyu, R.F.; Yang, H.H.; Lee, J.H.-
-The Micro-Mold Insert Forming Technology for Micro-Nozzle Plates楊錫杭-
-Microchannel heat sink fabrication with roughened bottom wallsYang, H.; 楊錫杭; Lee, F.; Chein, R.; 簡瑞與-
-Microcomposite electroforming for LIGA technologyChou, M.C.; 楊錫杭; Yang, H.; Yeh, S.H.-
-Miniaturized fluorescence excitation platform with optical fiber for bio-detection chipsYang, H.; 楊錫杭; Lee, C.T.; Chang, F.Y.-
-Miniaturized variable-focus lens fabrication using liquid filling techniqueYang, H.; 楊錫杭; Yang, C.Y.; Yeh, M.S.-
-Modeling and fabrication of a piezoelectric vibration-induced micro power generatorWang, G.J.; 楊錫杭; Yu, W.C.; Lin, Y.H.; Yang, H.; 王國禎-
-New electroforming technology pressure aid for LIGA processTsai, T.H.; 楊錫杭; Yang, H.; Chein, R.; 簡瑞與-
-New fabrication method for micro-pyramidal vertical probe array for probe cardsLin, T.H.; 楊錫杭; Yang, H.H.; Chao, C.K.; Yeh, M.S.-
-New high fill-factor triangular microlens array fabrication method using UV proximity printingLin, T.H.; 楊錫杭; Yang, H.H.; Chao, C.K.; Hung, S.Y.-