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| Issue Date | Title | Author(s) | Text |
| - | Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers | Dow, W.P.; 竇維平; Li, C.C.; Lin, M.W.; Su, G.W.; Huang, C.C. | - |
| - | Development of Electroplating Technology for Filling through Silicon VI as and Holes | 竇維平 | - |
| - | Effect of Chloride Ions on the Adsorption of 3-Mercapto-1-propanesulfonic acid and Bis(3-sulfopropyl)-disulfide on a Au(111) Surface | Liu, Y.F.; 竇維平; Lee, Y.L.; Yang, Y.C.; Jian, Z.Y.; Dow, W.P.; Yau, S.L. | - |
| - | Electroless Deposition of Barrier and Seed Layersof Through Silicon Via | 周嘉珮; Chou, Chia-Pei | - |
| - | Enhancement of filling performance of a copper plating formula at low chloride concentration | Dow, W.P.; 竇維平; Yen, M.Y.; Liu, C.W.; Huang, C.C. | - |
| - | Filling mechanism in microvia metallization by copper electroplating | Dow, W.P.; 竇維平; Yen, M.Y.; Liao, S.Z.; Chiu, Y.D.; Huang, H.C. | - |
| - | In Situ STM of 3-Mercaptopropanesulfonate Adsorbed on Pt(111) Electrode and Its Effect on the Electrodeposition of Copper | Tu, H.L.; 竇維平; Yen, P.Y.; Wu, H.L.; Chen, S.; Vogel, W.; Yau, S.; Dow, W.P. | - |
| - | In Situ STM Revelation of the Adsorption and Polymerization of Aniline on Au(111) Electrode in Perchloric Acid and Benzenesulfonic Acid | Lee, Y.; 竇維平; Chen, S.; Tu, H.; Yau, S.; Fan, L.J.; Yang, Y.W.; Dow, W.P. | - |
| - | Microvia filling by copper electroplating using diazine black as a leveler | Dow, W.P.; 竇維平; Li, C.C.; Su, Y.C.; Shen, S.P.; Huang, C.C.; Lee, C.; Hsu, B.; Hsu, S. | - |
| - | Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide | Dow, W.P.; 竇維平; Chiu, Y.D.; Yen, M.Y. | - |
| - | Modification of Cu nanoparticles with a disulfide for polyimide metallization | Dow, W.P.; 竇維平; Liao, G.L.; Huang, S.E.; Chen, S.W. | - |
| - | Revelation of the spatial structures and polymerization of aniline on Au(100) electrode by in situ scanning tunnelling microscopy | Yau, S.L.; 竇維平; Lee, Y.H.; Chang, C.Z.; Dow, W.P. | - |
| - | Scanning Tunneling Microscopy and Cyclic Voltammetry Study of Self-Assembled 3,3 '-Thiobis(1-propanesulfonic acid, sodium salt) Monolayers on Au(111) Electrodes | Liu, Y.F.; 竇維平; Krug, K.; Lin, P.C.; Chiu, Y.D.; Lee, Y.L.; Dow, W.P. | - |
| - | Structures of Aniline and Polyaniline Molecules Adsorbed on Au(111) Electrode: as Probed by in Situ STM, ex Situ XPS, and NEXAFS | Yau, S.L.; 竇維平; Lee, Y.H.; Chang, C.Z.; Fan, L.J.; Yang, Y.W.; Dow, W.P. | - |
| - | Through-Hole Filling by Copper Electroplating | Dow, W.P.; 竇維平; Chen, H.H.; Yen, M.Y.; Chen, W.H.; Hsu, K.H.; Chuang, P.Y.; Ishizuka, H.; Sakagawa, N.; Kimizuka, R. | - |
| - | 以不同酸液及陽極材料進行通孔電鍍 | Yu-Tien Lin; 林宇恬 | |
| - | 以化學鍍法成長白金薄膜及其於染料敏化太陽能電池之應用 | 陳嘉賢; Chen, Chia-Hsien | - |
| - | 以氧化鋅為中間層行玻璃表面金屬化 | Chi-Wen Cheng; 鄭家雯 | |
| - | 以石墨烯當導電層與阻障層用於矽通孔之電鍍填充 | Shih-Cheng Chang; 張世誠 | |
| - | 以石墨烯當矽穿孔之導電層與阻障層行鈷鎢合金與純鈷電鍍填充 | 陳依詠; Yi-Yung Chen | |
