Browsing by Author 竇維平


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Issue DateTitleAuthor(s)Text
-Microvia filling by copper electroplating using diazine black as a levelerDow, W.P.; 竇維平; Li, C.C.; Su, Y.C.; Shen, S.P.; Huang, C.C.; Lee, C.; Hsu, B.; Hsu, S.-
-Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a DisulfideDow, W.P.; 竇維平; Chiu, Y.D.; Yen, M.Y.-
-Modification of Cu nanoparticles with a disulfide for polyimide metallizationDow, W.P.; 竇維平; Liao, G.L.; Huang, S.E.; Chen, S.W.-
-Revelation of the spatial structures and polymerization of aniline on Au(100) electrode by in situ scanning tunnelling microscopyYau, S.L.; 竇維平; Lee, Y.H.; Chang, C.Z.; Dow, W.P.-
-Scanning Tunneling Microscopy and Cyclic Voltammetry Study of Self-Assembled 3,3 '-Thiobis(1-propanesulfonic acid, sodium salt) Monolayers on Au(111) ElectrodesLiu, Y.F.; 竇維平; Krug, K.; Lin, P.C.; Chiu, Y.D.; Lee, Y.L.; Dow, W.P.-
-Structures of Aniline and Polyaniline Molecules Adsorbed on Au(111) Electrode: as Probed by in Situ STM, ex Situ XPS, and NEXAFSYau, S.L.; 竇維平; Lee, Y.H.; Chang, C.Z.; Fan, L.J.; Yang, Y.W.; Dow, W.P.-
-Through-Hole Filling by Copper ElectroplatingDow, W.P.; 竇維平; Chen, H.H.; Yen, M.Y.; Chen, W.H.; Hsu, K.H.; Chuang, P.Y.; Ishizuka, H.; Sakagawa, N.; Kimizuka, R.-
-以不同酸液及陽極材料進行通孔電鍍Yu-Tien Lin; 林宇恬
-以化學鍍法成長白金薄膜及其於染料敏化太陽能電池之應用陳嘉賢; Chen, Chia-Hsien-
-以氧化鋅為中間層行玻璃表面金屬化Chi-Wen Cheng; 鄭家雯
-以石墨烯當導電層與阻障層用於矽通孔之電鍍填充Shih-Cheng Chang; 張世誠
-以石墨烯當矽穿孔之導電層與阻障層行鈷鎢合金與純鈷電鍍填充陳依詠; Yi-Yung Chen
-以磁控濺鍍法製備光學薄膜應用於Low-E玻璃之研究白清文; Ching-Wen Pai
-以還原氧化石墨烯作為導電層應用於印刷電路板金屬化張翊宣; I-Hsuan Chang
-以離子銅作為印刷電路板金屬化觸媒之研究張弘明; Hung-Ming Chang
-利用分子自組裝方法進行鍍銅之光澤劑濃度分析邱詠達; Chiu, Yong-Da-
-利用還原氧化石墨烯之接枝於矽與玻璃穿孔之電鍍銅填充研究陳柏廷; Po-Ting Chen
-利用還原氧化石墨烯作為導電層於聚亞醯胺金屬化製程開發張瑜蓁; Yu-Zhen Zhang
-功能性硫醇分子在金(111)電極上的自組裝行為及對電鍍銅的影響蘇敬文; Su, Jing-Wen-
-化學接枝技術應用於無鈀製程之聚碳酸酯基材表面金屬化Huei-Fang Huang; 黃慧芳