Browsing by Author Chen, C.M.

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Issue DateTitleAuthor(s)Text
-Identification of a novel Bacillus species isolated from Calculus BovisWan, T.C.; 林亮全; Cheng, F.Y.; Liu, Y.T.; Wang, C.M.; Shyu, C.L.; Chen, C.M.; Lin, L.C.; Sakata, R.-
-Immobilization of poly(N-vinyl-2-pyrrolidone)-capped platinum nanoclusters on indium-tin oxide glass and its application in dye-sensitized solar cellsWei, T.C.; 陳志銘; Wan, C.C.; Wang, Y.Y.; Chen, C.M.; Shiu, H.S.-
-Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder ballsChen, C.M.; 陳志銘; Lin, H.C.-
-Interfacial reactions between eutectic SnZn solder and bulk or thin-film cu substratesChen, C.M.; 陳志銘; Chen, C.H.-
-Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrateLin, C.P.; 陳志銘; Chen, C.M.; Lin, C.H.; Su, W.C.-
-Intermetallic catalyst for carbon nanotubes (CNTs) growth by thermal chemical vapor deposition methodChen, C.M.; 鄭紀民; Dai, Y.M.; Huang, J.G.; Jehng, J.M.-
-Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer BoardLin, C.P.; 陳志銘; Chen, C.M.-
-Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow solderingWang, K.Z.; 陳志銘; Chen, C.M.-
-Isothermal solid-state aging of Pb-5Sn solder bump on Ni/Cu/Ti under bump metallizationChen, C.M.; 陳志銘; Wang, K.J.; Chen, K.C.-
-Lactoferrin as a Natural Regimen for Selective Decontamination of the Digestive Tract: Recombinant Porcine Lactoferrin Expressed in the Milk of Transgenic Mice Protects Neonates from Pathogenic Challenge in the Gastrointestinal Tract陳全木; Yen, C.C.; Lin, C.Y.; Chong, K.Y.; Tsai, T.C.; Shen, C.J.; Lin, M.F.; Su, C.Y.; Chen, H.L.; Chen, C.M.-
-Lactoferrin: an iron-binding antimicrobial protein against Escherichia coli infectionYen, C.C.; 陳全木; Shen, C.J.; Hsu, W.H.; Chang, Y.H.; Lin, H.T.; Chen, H.L.; Chen, C.M.-
-Methylation target array for rapid analysis of CpG island hype rmethyl ation in multiple tissue genomesChen, C.M.; 陳全木; Chen, H.L.; Hsiau, T.H.C.; Hsiau, A.H.A.; Shi, H.D.; Brock, G.J.R.; Wei, S.H.; Caldwell, C.W.; Yan, P.S.; Huang, T.H.M.-
-Microstructural evolution of the Au-20 wt.% Sn solder on the Cu substrate during reflowChung, H.M.; 陳志銘; Chen, C.M.; Lin, C.P.; Chen, C.J.-
-Mitigative Tin Whisker Growth Under Mechanically Applied Tensile StressChen, Y.J.; 陳志銘; Chen, C.M.-
-Mobile IP assistance in ad hoc routing security using geometric properties of linesChang, T.Y.; Yang, C.C.; Chen, C.M.-
-Modulation of energy deficiency in Huntington's disease via activation of the peroxisome proliferator-activated receptor gammaChiang, M.C.; 李茂榮; Chen, C.M.; Lee, M.R.; Chen, H.W.; Chen, H.M.; Wu, Y.S.; Hung, C.H.; Kang, J.J.; Chang, C.P.; Chang, C.; Wu, Y.R.; Tsai, Y.S.; Chern, Y.-
-Morphological evolution of the reaction product at the Sn-9wt.%Zn/thin-film Cu interfaceChen, C.M.; 陳志銘; Chen, C.H.; Lin, C.P.; Su, W.C.-
-Nuclear Kruppel-like factor 4 expression is associated with human skin squamous cell carcinoma progression and metastasisChen, Y.J.; 陳全木; Wu, C.Y.; Chang, C.C.; Ma, C.J.; Li, M.C.; Chen, C.M.; 張嘉哲-
-Optimized Thermal Management From a Chip to a Heat Sink for High-Power GaN-Based Light-Emitting DiodesHorng, R.H.; 洪瑞華; Hong, J.S.; Tsai, Y.L.; Wuu, D.S.; Chen, C.M.; Chen, C.J.; 武東星; 陳志銘-