Showing results 1 to 20 of 38
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| Issue Date | Title | Author(s) | Text |
| - | (Clin. Cancer Res., 09(11):4034-4042)The androgen receptor gene is preferentially hypermethylated in follicular non-Hodgkin's lymphomas | H. Yang; C. M. Chen; P. S. Yan; T. H. M. Huang; H. Shi; M. Burger; I. Nimmrich; S. Maier; K. Berlin; C. W. Caldwell | - |
| - | (International Journal of Advanced Manufacturing Technology,121(12):1029-1034)Cumulative heat effect in excimer laser ablation polymer PC and ABS | M.K. Wei; H. Yang | - |
| - | (International Journal of Advanced Manufacturing Technology,29(5):518-523)Vacuum suction aid for microlens array formation using LIGA-like process | R.F. Shyu; H. Yang | - |
| - | (International Journal of Advanced Manufacturing Technology,34(9-10):889-897)248 nm Excimer Laser Drilling PI Film for Nozzle Plate Application | C.T. Pan; H. Yang; M.K. Wei | - |
| - | (International Journal of Advanced Manufacturing Technology,36:053-059)A promising thermal pressing used in fabricating microlens array | R.F. Shyu; H. Yang | - |
| - | (International Journal of Machine Tools & Manufacture,40:1065-1072)Improvement of thickness uniformity in nickel electroforming for the LIGA process | H. Yang; S.W. Kang | - |
| - | (Journal of Micromechanics and Microengineering,11(2):094-099)Ultra-fine machining tool/molds by LIGA technology | H. Yang; C.T. Pan; M.C. Chou | - |
| - | (Journal of Micromechanics and Microengineering,112(2):157-161)Excimer laser-induced formation of metallic microstructures by electroless copper plating | H. Yang; C.T. Pan | - |
| - | (Journal of Micromechanics and Microengineering,12(5):611-615)A low-temperature wafer bonding technique using patternable materials | C.T. Pan; H. Yang; S.C. Shen; M.C. Chou; H.P. Chou | - |
| - | (Journal of Micromechanics and Microengineering,13(5):748-757)A new microlens array fabrication method using UV proximity printing | C.P. Lin; H. Yang; C.K. Chao | - |
| - | ( Journal of Micromechanics and Microengineering,13(5):775-781)Hexagonal microlens array modeling and fabrication using a thermal reflow process | C.P. Lin; H. Yang; C.K. Chao | - |
| - | (Journal of Micromechanics and Microengineering,14(2):277-282)Micro-ball lens array modeling and fabrication using thermal reflow in two polymer layers | H. Yang; C.K. Chao; C.P. Lin; S.C. Shen | - |
| - | (Journal of Micromechanics and Microengineering,14(6):1197-1204)High fill-factor microlens array mold insert fabrication using a thermal reflow process | H. Yang; C.K. Chao; M.K. Wei; C.P. Lin | - |
| - | (Journal of Micromechanics and Microengineering,17:419-425)Fabrication of a microlens array electroformed mold with low roughness and high hardness | T.H. Lin; S.Y. Hung; H. Yang; C.K. Chao | - |
| - | (Journal of the Chinese Institute of Engineers,29(4):697-706)Modeling and Fabrication of a Piezoelectric Vibration-Induced Micro Power Generator | G.J. Wang; W.C. Yu; Y.H. Lin; H. Yang | - |
| - | (Key Engineering Materials,364-366:955-960)Diffration effect in proximity printing of circular aperture array | J.C. Tsai; M.Y. Hsieh; H. Yang | - |
| - | (Materials Science and Technology,23(8):980-986)PET Polymer Ablation Using Excimer Laser for Nozzle Plate Applications | C.T. Pan; H. Yang; M.K. Wei; F.Y. Chang | - |
| - | (Materials Science Forum,505-507(2):271-276)Fabrication of Rolling Mold for a 200μm Microlens Array by 3D LIGA-Like Processes | J.C. Tsai; K. Liu; H. Yang | - |
| - | (Microsystem Technologies,07:036-039)Microcomposite electroforming for LIGA technology | M.C. Chou; H. Yang; S.H. Yeh | - |
| - | (Microsystem Technologies,10(2):155-160)Optical switch with auto-aligning fibers and latching micro-mirrors | H. Yang; C.T. Pan; S.C. Shen | - |
