Browsing by Author H.P. Chou
Showing results 1 to 1 of 1
Issue Date | Title | Author(s) | Text |
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- | (Journal of Micromechanics and Microengineering,12(5):611-615)A low-temperature wafer bonding technique using patternable materials | C.T. Pan; H. Yang; S.C. Shen; M.C. Chou; H.P. Chou | - |