Browsing by Author Liang, S.C.


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Issue DateTitleAuthor(s)Text
-Thermally Stable TiVCrZrHf Nitride Films as Diffusion Barriers in Copper MetallizationLiang, S.C.; Tsai, D.C.; Chang, Z.C.; Lin, T.N.; Shiao, M.H.; Shieu, F.S.-