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Issue DateTitleAuthor(s)Text
-(Biomedical Microdevices,06(1):047-053)Centrifugal and electrical field forces dual-pumping CD-like microfludic platform for biomedical separationGou Jen Wang; Wen Haw Hsu; Yau Zin Chang; Hsiharng Yang-
-(International Journal of Advanced Manufacturing Technology,121(12):1029-1034)Cumulative heat effect in excimer laser ablation polymer PC and ABSM.K. Wei; H. Yang-
-(International Journal of Advanced Manufacturing Technology,29(5):518-523)Vacuum suction aid for microlens array formation using LIGA-like processR.F. Shyu; H. Yang-
-(International Journal of Advanced Manufacturing Technology,34(9-10):889-897)248 nm Excimer Laser Drilling PI Film for Nozzle Plate ApplicationC.T. Pan; H. Yang; M.K. Wei-
-(International Journal of Advanced Manufacturing Technology,36:053-059)A promising thermal pressing used in fabricating microlens arrayR.F. Shyu; H. Yang-
-(International Journal of Machine Tools & Manufacture,40:1065-1072)Improvement of thickness uniformity in nickel electroforming for the LIGA processH. Yang; S.W. Kang-
-(Journal of Micromechanics and Microengineering,11(2):094-099)Ultra-fine machining tool/molds by LIGA technologyH. Yang; C.T. Pan; M.C. Chou-
-(Journal of Micromechanics and Microengineering,112(2):157-161)Excimer laser-induced formation of metallic microstructures by electroless copper platingH. Yang; C.T. Pan-
-(Journal of Micromechanics and Microengineering,12(5):611-615)A low-temperature wafer bonding technique using patternable materialsC.T. Pan; H. Yang; S.C. Shen; M.C. Chou; H.P. Chou-
-(Journal of Micromechanics and Microengineering,13(5):748-757)A new microlens array fabrication method using UV proximity printingC.P. Lin; H. Yang; C.K. Chao-
-( Journal of Micromechanics and Microengineering,13(5):775-781)Hexagonal microlens array modeling and fabrication using a thermal reflow processC.P. Lin; H. Yang; C.K. Chao-
-(Journal of Micromechanics and Microengineering,14(2):277-282)Micro-ball lens array modeling and fabrication using thermal reflow in two polymer layersH. Yang; C.K. Chao; C.P. Lin; S.C. Shen-
-(Journal of Micromechanics and Microengineering,14(6):1197-1204)High fill-factor microlens array mold insert fabrication using a thermal reflow processH. Yang; C.K. Chao; M.K. Wei; C.P. Lin-
-(Journal of Micromechanics and Microengineering,17:419-425)Fabrication of a microlens array electroformed mold with low roughness and high hardnessT.H. Lin; S.Y. Hung; H. Yang; C.K. Chao-
-(Journal of the Chinese Institute of Engineers,29(4):697-706)Modeling and Fabrication of a Piezoelectric Vibration-Induced Micro Power GeneratorG.J. Wang; W.C. Yu; Y.H. Lin; H. Yang-
-(Journal of the Chinese Society of Mechanical Engineers,27(5):611-616)Bonding strength measurement of electroforming porous copper for heat sinksH.Yang; C.C. Wu; W.L. Hsueh-
-(Key Engineering Materials,364-366:955-960)Diffration effect in proximity printing of circular aperture arrayJ.C. Tsai; M.Y. Hsieh; H. Yang-
-(Materials Science and Technology,23(8):980-986)PET Polymer Ablation Using Excimer Laser for Nozzle Plate ApplicationsC.T. Pan; H. Yang; M.K. Wei; F.Y. Chang-
-(Materials Science Forum,505-507(2):271-276)Fabrication of Rolling Mold for a 200μm Microlens Array by 3D LIGA-Like ProcessesJ.C. Tsai; K. Liu; H. Yang-
-(Microsystem Technologies,07:036-039)Microcomposite electroforming for LIGA technologyM.C. Chou; H. Yang; S.H. Yeh-