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| Issue Date | Title | Author(s) | Text |
| - | 10-nm-thick quinary (AlCrTaTiZr)N film as effective diffusion barrier for Cu interconnects at 900 degrees C | Chang, S.Y.; 張守一; Chen, D.S. | - |
| - | 4-nm thick multilayer structure of multi-component (AlCrRuTaTiZr)N-x as robust diffusion barrier for Cu interconnects | Chang, S.Y.; 張守一; Li, C.E.; Chiang, S.C.; Huang, Y.C. | - |
| - | Analyses of interface adhesion between Cu and SiCN etch stop layers by nanoindentation and nanoscratch tests | Chang, S.Y.; 張守一; Lee, Y.S. | - |
| - | Analyses of interface adhesion between porous SiO2 low-k film and SiC/SiN layers by nanoindentation and nanoscratch tests | 張守一; Chang, S.Y.; Huang, Y.C. | - |
| - | Analyses of interface adhesion between porous SiOCH low-k film and SiCN layers by nanoindentation and nanoscratch tests | Chang, S.Y.; 張守一; Tsai, H.C.; Chang, J.Y.; Lin, S.J.; Chang, Y.S. | - |
| - | Analysis of interfacial shear strength of SiC fiber reinforced 7075 aluminum composite by pushout microindentation | 張守一; Chen, L.G.; Lin, S.J.; Chang, S.Y. | - |
| - | Anomalous decrease in X-ray diffraction intensities of Cu-Ni-Al-Co-Cr-Fe-Si alloy systems with multi-principal elements | 張守一; Yeh, J.W.; Chang, S.Y.; Hong, Y.D.; Chen, S.K.; Lin, S.J. | - |
| - | Antibacterial behavior of TaN-Ag nanocomposite thin films with and without annealing | Hsieh, J.H.; 張守一; Tseng, C.C.; Chang, Y.K.; Chang, S.Y.; Wu, W.; 吳威德 | - |
| - | Assembled GaN : Mg inverted hexagonal pyramids formed through a photoelectrochemical wet-etching process | Lin, C.F.; 張守一; Dai, J.J.; Yang, Z.J.; Zheng, J.H.; Chang, S.Y. | - |
| - | Atomic-scale observation on the nucleation and growth of displacement-activated palladium catalysts and electroless copper plating | Lai, C.H.; 張守一; Sung, Y.C.; Lin, S.J.; Chang, S.Y.; Yeh, J.W. | - |
| - | Characteristics of a 10 nm-thick (TiVCr)N multi-component diffusion barrier layer with high diffusion resistance for Cu interconnects | Tsai, D.C.; 張守一; Huang, Y.L.; Lin, S.R.; Jung, D.R.; Chang, S.Y.; Chang, Z.C.; Deng, M.J.; Shieu, F.S.; 薛富盛 | - |
| - | The Characteristics of Aluminum/Magnesium Multi-layers Composite after Accumulative Roll Bonding | Chen, Ming-Che; 陳明哲 | - |
| - | Chemical-Mechanical Lift-Off Process for InGaN Epitaxial Layers | Lin, M.S.; 張守一; Lin, C.F.; Huang, W.C.; Wang, G.M.; Shieh, B.C.; Dai, J.J.; Chang, S.Y.; Wuu, D.S.; Liu, P.L.; Horng, R.H.; 洪瑞華; 武東星; 林佳鋒 | - |
| - | Curing process window and thermal stability of porous MSQ-based low-dielectric-constant materials | Chang, S.Y.; 張守一; Chou, T.J.; Lu, Y.C.; Jang, S.M.; Lin, S.J.; Liang, M.S. | - |
| - | Cytotoxicity and Cytomechanical Effect of Gold and Silver Nanoparticles on Red blood Cells of Rat | 謝玉瑩; Shie, Yu-Ying | - |
| - | Deformation behavior of electrolessly deposited ultrafine nanocrystalline copper films under instrumented nanoindentation | Chang, S.Y.; 張守一; Chang, T.K.; Lee, Y.S. | - |
| - | Diffusion barrier performance of TiVCr alloy film in Cu metallization | Tsai, D.C.; 張守一; Huang, Y.L.; Lin, S.R.; Jung, D.R.; Chang, S.Y.; Shieu, F.S.; 薛富盛 | - |
| - | Early-stage nucleation crystallography of sensitization-activated palladium catalysts and electrolessly deposited copper films | Sung, Y.C.; 張守一; Lai, C.H.; Lin, S.J.; Chang, S.Y. | - |
| - | Effect of collagen on the mechanical properties of hydroxyapatite coatings | 張守一; Ou, K.L.; Chung, R.J.; Tsai, F.Y.; Liang, P.Y.; Huang, S.W.; Chang, S.Y. | - |
| - | Effect of nitrogen addition on the properties and thermal stability of fluorinate amorphous carbon films | Lai, C.H.; 張守一; Lai, W.S.; Chiue, H.C.; Chen, H.J.; Chang, S.Y.; Lin, S.J. | - |
