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| Issue Date | Title | Author(s) | Text |
| - | 309系列手銲條
應用於超高強度鋼板對接之研究 | 翁新凱; Weng, Shin-Kai | - |
| - | The Analysis of Roller Vibration Modal Mechanism by Using Finite Element Method | Yu-Cheng Lin; 林榆成 | |
| - | DESIGN A FAST TRACKING RESOLVER TO DIGITAL CONVERSION METHOD USING FPGA FOR ROTARY MOTION APPLICATIONS | Tseng, P.H.; 林明澤; Tong, C.J.; Lin, M.T. | - |
| - | Design and development of a novel paddle test structure for the mechanical behavior measurement of thin films application for MEMS | Tong, C.J.; 林明澤; Lin, M.T. | - |
| - | Design and development of sub-micron scale specimens with electroplated structures for the microtensile testing of thin films | Lin, M.T.; 林明澤; Tong, C.J.; Chiang, C.H. | - |
| - | Design Optimization of the Casting Nozzle Using Computer Simulation | Heng-Jen Kuo; 郭恒任 | |
| - | Digital image correlation of SEM images for surface deformation of CMOS IC | Terry Yuan-Fang Chen; Tzu-Ching Chen; Fa-Yen Cheng; Ang-Ting Tsai; Ming-Tzer Lin; 林明澤 | |
| - | Dynamics analysis of advanced recycling method for the steelmaking dephosphorization | Chou-Cheng Wu; 吳洲呈 | |
| - | Effect of Temperature on Energy Loss and Internal Friction in Nanocrystalline Metal Thin Films | Yu-Ting Wang; 王瑜婷 | |
| - | Effects of Electrical Current and External Stress on the Electromigration of Intermetallic Compounds Between the Flip-Chip Solder and Copper Substrate | Wei-Jhen Chen; Yue-Lin Lee; Ti-Yuan Wu; Tzu-Ching Chen; Chih-Hui Hsu; Ming-Tzer Lin; 林明澤 | |
| - | Electromagnetic ABS for Electrical Vehicles Using Ultra-Capacitor | Chia-Hung Tu; 涂嘉宏 | |
| - | External applied stress and interface effects on texture transformation in Ag thin films | Ya-Chi Cheng; 鄭雅琪 | |
| - | The influence of vanadium alloying on the elevated-temperature mechanical properties of thin gold films | Lin, M.T.; 林明澤; Chrornik, R.R.; Barbosa, N.; El-Deiry, P.; Hyun, S.; Brown, W.L.; Vinci, R.P.; Delph, T.J. | - |
| - | The Measurement of Time and Temperature of Al and Al Alloy Thin Film Creep Behavior Using Bulge Test | Cheng-Hua Lu; 呂承樺 | |
| - | Mechanical Behavior of Thin Film: IMC Growth, Internal Friction, Stress and Scale Effects | Feng-Chih Hsu; 許豐智 | |
| - | The Mechanical Properties Measurement of Titanium Nitride Thin Film with respect to Different Process Parameters Using Bulge Test | Chien-Hua Chen; 陳建華 | |
| - | Mechanism and Properties Investigation of Novel Grain Boundary Migration, Internal Friction, Elastic-Plastic Deformation, Cyclic and Temperature Dependent Creep of Nanocrystallize Thin Films | 林明澤 | - |
| - | Monotonic and fatigue testing of freestanding submicron thin beams application for MEMS | Lin, M.T.; 林明澤; Tong, C.J.; Shiu, K.S. | - |
| - | MR21型式發光二極體燈具散熱器之熱分析與結構探討 | 黃俊彥; Huang, Jyun-Yan | - |
| - | Novel heat dissipation design for light emitting diode applications | Chang, C.C.; 林明澤; Huang, D.S.; Lin, M.T.; Horng, R.H.; Lai, C.M.; 洪瑞華 | - |
