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| Issue Date | Title | Author(s) | Text |
| - | Applications of Eletrochemical Impedance Spectroscopy Study in Dye-Sensitized Solar Cells | Shie, Feng-Jan; 謝逢展 | - |
| - | Atomic migration in eutectic SnBi solder alloys due to current stressing | Chen, C.M.; 陳志銘; Huang, C.C. | - |
| - | Au-20wt.%Sn銲料與Cu基材之界面反應 | 鍾享牟; Chung, Hsiang-Mou | - |
| - | Chemical deposition of platinum on metallic sheets as counterelectrodes for dye-sensitized solar cells | Chen, C.M.; 陳志銘; Chen, C.H.; Wei, T.C. | - |
| - | Chromatic Titanium Photoanode for Dye-Sensitized Solar Cells under Rear Illumination | Huang, Chih-Hsiang; Chen, Yu-Wen; Chen, Chih-Ming; 陳志銘 | |
| - | A current-induced localized heating technique for fabrication of carbon nanomaterials | Lin, Y.W.; 陳志銘; Shih, P.Y.; Chen, C.M. | - |
| - | Development of Green Technology of Synthesis of Carbon Nanomaterials Using Reccycled Printed Circuit Boards as Carbon Source and the Study of Mechanism | 陳志銘 | - |
| - | Development of nanotwins in electroplated copper and its effect on shear strength of tin/copper joint | Hsuan Lee; Yi-An Wang; Chih-Ming Chen; 陳志銘 | |
| - | Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow | Chen, C.H.; 陳志銘; Lin, C.P.; Chen, C.M. | - |
| - | Effect of temperature on microstructural changes of the Sn-9 wt.% Zn lead-free solder stripe under current stressing | Chen, C.M.; 陳志銘; Hung, Y.M.; Lin, C.P.; Su, W.C. | - |
| - | Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing | Chen, C.M.; 陳志銘; Huang, C.C.; Liao, C.N.; Liou, K.M. | - |
| - | Effects of silver doping on electromigration of eutectic SnBi solder | Chen, C.M.; 陳志銘; Huang, C.C. | - |
| - | Efficiency improvement of dye-sensitized solar cells by in situ fluorescence resonance energy transfer | Yu-Jie Lin; Jyun-Wei Chen; Po-Tsung Hsiao; Yung-Liang Tung; Cheng-Chung Chang; 陳志銘; Chih-Ming Chen | |
| - | Electroless deposition of platinum on indium tin oxide glass as the counterelectrode for dye-sensitized solar cells | Chen, C.M.; 陳志銘; Chen, C.H.; Cherng, S.J.; Wei, T.C. | - |
| - | Electromigration of Sn-8 wt.% Zn-3 wt.% Bi and Sn-9 wt.% Zn-1 wt.% Cu solders | Chen, C.M.; 陳志銘; Hung, Y.M.; Lin, C.H. | - |
| - | Electromigration of Sn-9wt.%Zn solder | Hung, Y.M.; 陳志銘; Chen, C.M. | - |
| - | Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization | Chen, L.T.; 陳志銘; Chen, C.M. | - |
| - | Electromigration-induced Bi segregation in eutectic SnBi solder joint | Chen, C.M.; 陳志銘; Chen, L.T.; Lin, Y.S. | - |
| - | Foreword | Chen, S.W.; 陳志銘; Chada, S.; Chen, C.M.; Flandorfer, H.; Lindsay Greer, A.; Lee, J.H.; Zeng, K.J.; Suganuma, K. | - |
| - | Growth orientation of the tin whiskers on an electrodeposited Sn thin film under three-point bending | Chen, C.M.; 陳志銘; Chen, Y.J. | - |
