Browsing by Author Chang, Z.C.

Showing results 1 to 12 of 12
Issue DateTitleAuthor(s)Text
-Characteristics of a 10 nm-thick (TiVCr)N multi-component diffusion barrier layer with high diffusion resistance for Cu interconnectsTsai, D.C.; 張守一; Huang, Y.L.; Lin, S.R.; Jung, D.R.; Chang, S.Y.; Chang, Z.C.; Deng, M.J.; Shieu, F.S.; 薛富盛-
-Characteristics of TiVCrAlZr multi-element nitride films prepared by reactive sputteringChang, Z.C.; 薛富盛; Liang, S.C.; Han, S.; Chen, Y.K.; Shieu, F.S.-
-Characterization and formation mechanism of macroparticles in arc ion-plated CrN thin filmsShiao, M.H.; 薛富盛; Chang, Z.C.; Shieu, F.S.-
-Characterization of the microstructure and phase formation in the Au-In system using transmission electron microscopyChang, Z.C.; 呂福興; Lu, F.H.; Shieu, F.S.; 薛富盛-
-Effect of metal vapor vacuum arc Cr-implanted interlayers on the microstructure of CrN film on siliconHan, S.; 呂福興; Chen, H.Y.; Chang, Z.C.; Lin, J.H.; Yang, C.J.; Lu, F.H.; Shieu, F.S.; Shih, H.C.; 薛富盛-
-Effect of microstructure on the nanomechanical properties of TiVCrZrAl nitride films deposited by magnetron sputteringChang, Z.C.; Liang, S.C.; Han, S.-
-Effect of repetition nanoindentation of GaN epilayers on a-axis sapphire substratesLin, M.H.; Wen, H.C.; Chang, Z.C.; Wu, S.C.; Wu, W.F.; Chou, C.P.-
-Effects of substrate temperature on the structure and mechanical properties of (TiVCrZrHf)N coatingsLiang, S.C.; 薛富盛; Chang, Z.C.; Tsai, D.C.; Lin, Y.C.; Sung, H.S.; Deng, M.J.; Shieu, F.S.-
-Intermetallic phase formation and shear strength of a Au-In microjointShieu, F.S.; 薛富盛; Chen, C.F.; Sheen, J.G.; Chang, Z.C.-
-Microstructure and shear strength of a Au-In microjointShieu, F.S.; 薛富盛; Chang, Z.C.; Sheen, J.G.; Chen, C.F.-
-Structural and mechanical properties of multi-element (TiVCrZrHf)N coatings by reactive magnetron sputteringLiang, S.C.; 薛富盛; Tsai, D.C.; Chang, Z.C.; Sung, H.S.; Lin, Y.C.; Yeh, Y.J.; Deng, M.J.; Shieu, F.S.-
-Thermally Stable TiVCrZrHf Nitride Films as Diffusion Barriers in Copper MetallizationLiang, S.C.; Tsai, D.C.; Chang, Z.C.; Lin, T.N.; Shiao, M.H.; Shieu, F.S.-