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| Issue Date | Title | Author(s) | Text |
| - | An approach to fabricating microstructures that incorporate circuits using a post-CMOS process | Dai, C.L.; 戴慶良; Xiao, F.Y.; Juang, Y.Z.; Chiu, C.F. | - |
| - | A capacitive humidity sensor integrated with micro heater and ring oscillator circuit fabricated by CMOS-MEMS technique | Dai, C.L.; 戴慶良 | - |
| - | Capacitive Micro Pressure Sensor Integrated with a Ring Oscillator Circuit on Chip | Dai, C.L.; 戴慶良; Lu, P.W.; Chang, C.L.; Liu, C.Y. | - |
| - | Capacitive micro pressure sensors with underneath readout circuit using a standard CMOS process | Dai, C.L.; 戴慶良; Chang, S.C.; Lee, C.Y.; Cheng, Y.C.; Chang, C.L.; Chiou, J.H.; Chang, P.Z. | - |
| - | Capacitive RF switches manufactured by the CMOS-MEMS technique | Yang, M.Z.; 戴慶良; Dai, C.L.; Shih, P.J.; Tsai, Z.Y. | - |
| - | A circular microchannel integrated with embedded sprial electrodes used for fluid transportation | Yang, L.J.; 戴慶良; Wang, J.M.; Ko, K.C.; Shih, W.P.; Dai, C.L. | - |
| - | A circular micromirror array fabricated by a maskless post-CMOS process | Cheng, Y.C.; 戴慶良; Dai, C.L.; Lee, C.Y.; Chen, P.H.; Chang, P.Z. | - |
| - | Cobalt Oxide Nanosheet and CNT Micro Carbon Monoxide Sensor Integrated with Readout Circuit on Chip | Dai, C.L.; 戴慶良; Chen, Y.C.; Wu, C.C.; Kuo, C.F. | - |
| - | Complementary metal-oxide-semiconductor microelectromechanical pressure sensor integrated with circuits on chip | Dai, C.L.; 戴慶良; Liu, M.C. | - |
| - | Effect of annealing temperature for Si0.8Ge0.2 epitaxial thin films | Chang, Y.M.; 戴慶良; Dai, C.L.; Cheng, T.C.; Hsu, C.W. | - |
| - | Fabrication and characterization of a microelectromechanical tunable capacitor | Dai, C.L.; 戴慶良; Lin, S.C.; Chang, M.W. | - |
| - | Fabrication and Characterization of a Tunable In-plane Resonator with Low Driving Voltage | Kao, P.H.; 戴慶良; Dai, C.L.; Hsu, C.C.; Lee, C.Y. | - |
| - | Fabrication and Characterization of CMOS-MEMS Thermoelectric Micro Generators | Kao, P.H.; 戴慶良; Shih, P.J.; Dai, C.L.; Liu, M.C. | - |
| - | Fabrication of a micromachined tunable capacitor using the complementary metal-oxide-semiconductor post-process of etching metal layers | Dai, C.L.; 戴慶良; Hsu, H.M.; Liu, M.C.; Wei, M.K.; Chang, M.W. | - |
| - | Fabrication of integrated chip with microinductors and micro-tunable capacitors by complementary metal-oxide-semiconductor postprocess | Dai, C.L.; 戴慶良; Tsai, C.H. | - |
| - | Fabrication of Wireless Micro Pressure Sensor Using the CMOS Process | Dai, C.L.; 戴慶良; Lu, P.W.; Wu, C.C.; Chang, C.L. | - |
| - | Improvement of the outcoupling efficiency of an organic light-emitting device by attaching microstructured films | Lin, H.Y.; 戴慶良; Lee, J.H.; Wei, M.K.; Dai, C.L.; Wu, C.F.; Ho, Y.H.; Wu, T.C. | - |
| - | In situ electrostatic microactuators for measuring the Young's modulus of CMOS thin films | Dai, C.L.; 戴慶良 | - |
| - | Low voltage actuated RF micromechanical switches fabricated using CMOS-MEMS technique | Dai, C.L.; 戴慶良; Chen, J.H. | - |
| - | Manufacture of a Polyaniline Nanofiber Ammonia Sensor Integrated with a Readout Circuit Using the CMOS-MEMS Technique | Liu, M.C.; 戴慶良; Dai, C.L.; Chan, C.H.; Wu, C.C. | - |
