Browsing by Author David Tarng

Showing results 1 to 2 of 2
Issue DateTitleAuthor(s)Text
-Light enhanced direct Cu bonding for advanced electronic assemblySin-Yong Liang; Jenn-Ming Song; 宋振銘; Shang-Kun Huang; Ying-Ta Chiu; David Tarng; Chih-Pin Hung-
-Stress-enhanced Cu-to-Cu Bonding for MEMS PackagingJenn-Ming Song; Sin-Yong Liang; Zong-Yu Xie; Po-Hao Chiang; Shang-Kun Huang; Ying-Ta Chiu; David Tarng; Chih-Pin Hung; Jing-Yuan Lin