Browsing by Author Hsuan Lee
Showing results 1 to 5 of 5
Issue Date | Title | Author(s) | Text |
---|---|---|---|
- | Development of nanotwins in electroplated copper and its effect on shear strength of tin/copper joint | Hsuan Lee; Yi-An Wang; Chih-Ming Chen; 陳志銘 | |
- | Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints | Hsuan Lee; Tai-Yi Yu; Hsi-Kuei Cheng; Kuo-Chio Liu; Po-Fan Chan; Wei-Ping Dow; 陳志銘; Chih-Ming Chen | |
- | A Study on the Structural Parameters of Joint Interface | 李萱; Hsuan Lee | |
- | Suppression effect of Ni grain size on the Ni3Sn4 growth at the Sn/Ni interface | Yu-Chen Tseng; Hsuan Lee; Shan-Chen Tsai; Yee-Wen Yen; 陳志銘; Chih-Ming Chen | |
- | 微量電鍍配方調整達到鍍層雜質與錫銅接點孔洞抑制之技術 | 李軒; Hsuan Lee |