Browsing by Author Jing-Yuan Lin

Showing results 1 to 4 of 4
Issue DateTitleAuthor(s)Text
-Copper seed layer repair using an electroplating process for through siliconvia metallization-
-Low temperature de-oxidation for copper surface by catalyzed formic acid vaporPei-Wen Chou; Jenn-Ming Song; 宋振銘; Zong-Yu Xie; Masatake Akaike; Tadatomo Suga; Masahisa Fujino; Jing-Yuan Lin
-Periodic Pulse Reverse Cu Plating for Through-Hole Filling-
-Stress-enhanced Cu-to-Cu Bonding for MEMS PackagingJenn-Ming Song; Sin-Yong Liang; Zong-Yu Xie; Po-Hao Chiang; Shang-Kun Huang; Ying-Ta Chiu; David Tarng; Chih-Pin Hung; Jing-Yuan Lin