Browsing by Author Jung, D.R.

Showing results 1 to 5 of 5
Issue DateTitleAuthor(s)Text
-Characteristics of a 10 nm-thick (TiVCr)N multi-component diffusion barrier layer with high diffusion resistance for Cu interconnectsTsai, D.C.; 張守一; Huang, Y.L.; Lin, S.R.; Jung, D.R.; Chang, S.Y.; Chang, Z.C.; Deng, M.J.; Shieu, F.S.; 薛富盛-
-Diffusion barrier performance of TiVCr alloy film in Cu metallizationTsai, D.C.; 張守一; Huang, Y.L.; Lin, S.R.; Jung, D.R.; Chang, S.Y.; Shieu, F.S.; 薛富盛-
-Effect of nitrogen flow ratios on the microstructure and properties of (TiVCr)N coatings by reactive magnetic sputteringTsai, D.C.; 薛富盛; Huang, Y.L.; Lin, S.R.; Jung, D.R.; Shieu, F.S.-
-Sputtering pressure effects on the structural and mechanical properties of TiVCr alloy coatingsTsai, D.C.; 薛富盛; Huang, Y.L.; Lin, S.R.; Jung, D.R.; Shieu, F.S.-
-Structure and mechanical properties of (TiVCr)N coatings prepared by energetic bombardment sputtering with different nitrogen flow ratiosTsai, D.C.; 張守一; Huang, Y.L.; Lin, S.R.; Jung, D.R.; Chang, S.Y.; Shieu, F.S.; 薛富盛-