Browsing by Author Ming-Tzer Lin


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Issue DateTitleAuthor(s)Text
-309系列手銲條 應用於超高強度鋼板對接之研究翁新凱; Weng, Shin-Kai-
-Design Optimization of the Casting Nozzle Using Computer SimulationHeng-Jen Kuo; 郭恒任
-Digital image correlation of SEM images for surface deformation of CMOS ICTerry Yuan-Fang Chen; Tzu-Ching Chen; Fa-Yen Cheng; Ang-Ting Tsai; Ming-Tzer Lin; 林明澤
-Effect of Loading Stress on the Growth of Cn/Sn Intermetallic Compounds at High TemperaturesYa-Chi Cheng; Yu-Ting Wang; Feng-Chih Hsu; Fang-Ching Lu; Chung-Lin Wu; Ming-Tzer Lin-
-Effect of Temperature on Energy Loss and Internal Friction in Nanocrystalline Metal Thin FilmsYu-Ting Wang; 王瑜婷
-Effects of Electrical Current and External Stress on the Electromigration of Intermetallic Compounds Between the Flip-Chip Solder and Copper SubstrateWei-Jhen Chen; Yue-Lin Lee; Ti-Yuan Wu; Tzu-Ching Chen; Chih-Hui Hsu; Ming-Tzer Lin; 林明澤
-Electromagnetic ABS for Electrical Vehicles Using Ultra-CapacitorChia-Hung Tu; 涂嘉宏
-The Measurement of Time and Temperature of Al and Al Alloy Thin Film Creep Behavior Using Bulge TestCheng-Hua Lu; 呂承樺
-Mechanical Behavior of Thin Film: IMC Growth, Internal Friction, Stress and Scale EffectsFeng-Chih Hsu; 許豐智
-Simulation of a high-power LED lamp for the evaluation and design of heat dissipation mechanismsDe-Shau Huang; Heng-Jen Kuo; Yi-Sheng Liao; Fang-Jui Kuo; Ming-Tzer Lin
-STRUCTURE DESIGN, DYNAMIC TESTING AND ANALYSIS ON THE MICRO PIEZOELECTRIC PRESSURE SENSORGuan-Chen Lin; 林冠辰
-Study of external stress and electromigration effects on copper-tin intermetallic formation using bulge testFang-Jui kuo; 郭芳瑞
-The study of internal friction and energy loss in nanocrystalline Cu thin filmYun-Fu Shieh; 謝雲簠
-Temperature Dependent Micromechanical Testing on the Formation of Ag/Sn Intermetallic Thin FilmsChien-He Chen; 陳見和
-The Thermal-Structural Analysis of Preheat Melting Nozzle using Finite Element MethodHan Kao; 高 漢
-Time and Temperature Dependence of Viscoelastic Stress Relaxation in Al and Al Alloy Thin FilmsAn-Wen Huang; 黃安妏
-Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packagingDe-Shau Huang; Wen-Bin Tu; Xiu-Ming Zhang; Liang-Te Tsai; Ti-Yuan Wu; Ming-Tzer Lin; 林明澤
-Using Taguchi Methods for Design Optimization of Silver Wire Bonding ProcessYueh-Huan Li; 李岳桓
-Using the Taguchi Method Experimental Analysis of Electrostatic Chuck(ESC) from Wafer Process to Improve the Offset Parameter Optimization StudyYen Kun-Zhi; 顏堃至
-Viscoelastic mechanical properties measurement of thin Al and Al–Mg films using bulge testingAn-Wen Huang; Cheng-Hua Lu; Shao-Chi Wu; Tzu-Ching Chen; Richard P. Vinci; Walter L. Brown; Ming-Tzer Lin; 林明澤