Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/10016
標題: Ineterfacial Reactions and Microstructural Analysis of the Sn-Zn-Cu System
錫-鋅-銅界面反應與微結構分析
作者: 張正彥
Chang, Chen Yen
關鍵字: lead-free;無鉛銲錫
出版社: 材料工程學研究所
摘要: 
Interfacial reactions and microstructural analysis of the Sn/Zn and Zn (electroplated)/Cu binary systems, and Sn (electroplated)/Zn (electroplated)/Cu, and Sn-9Zn/Cu ternary systems upon heat treatment at 200, 250, and 300℃ for 5 and 30 min in formic acid atmosphere are investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM) and field-emission scanning electron microscopy (FE-SEM).
In the case of the Sn/Zn system, the result shows that Zn dissolves into Sn and forms an eutectic layered structure, upon heat treatment of the specimen at 300℃for 5 min; whereas in the system of Zn (electroplated)/Cu, a new intermetallic compound, γ-Cu5Zn8, was formed at the Zn/Cu interface upon annealing at 200, 250, and 300℃ for 5 min. In the Sn (electroplated)/Zn (electroplated)/Cu ternary system heat-treated at 200℃、250℃and 300℃for 5 min, it is observed that Cu diffuses into the Zn layer and forms theγ-Cu5Zn8 intermetallic phase. As the heat treatment temperature was raised to 300℃, it is found that Sn diffuses into the Cu5Zn8 layer and a (Cu1-x Snx)5Zn8 phase was produced. In contrast, only theγ-Cu5Zn8 phase is detected in the Sn-Zn/Cu ternary system for the specimens heat-treated at 250 and 300℃ for 5 and 30 min, and the thickness of the intermetallic layer increases with temperature and annealing time.

本研究藉由X光繞射分析儀(XRD)、掃描式電子顯微鏡(SEM)和場發射掃描式電子顯微鏡(FE-SEM)等儀器分析Sn(塊材)/Zn板、Zn(電鍍)/Cu板、Sn(電鍍)/Zn(電鍍)/Cu板和共晶Sn-9Zn/Cu板於蟻酸氣氛中,在溫度為200、250和300℃、時間為5、30分鐘熱處理條件下界面反應與微結構分析,作為無鉛Sn-Zn在未來電子構裝中使用的參考。
Sn(塊材)/Zn板在溫度為300℃、時間為5分鐘浸漬熱處理後,片狀之Zn與共晶Sn-9Zn層狀組織分佈於原Sn中。Zn(電鍍)/Cu板在溫度為200、250及300℃時間為5分鐘熱處理後,界面處生成γ-Cu5Zn8介金屬相。Sn(電鍍)/Zn(電鍍)/Cu板在溫度為200、250與300℃、時間為5分鐘熱處理後,Cu擴散到原電鍍之Zn層反應形成γ-Cu5Zn8介金屬相,當熱處理溫度上升至300℃時,發現Sn擴散進入Cu-Zn介金屬相中取代部份Cu原子位置,使得原γ-Cu5Zn8介金屬相轉變成γ-(Cu1-XSnX)5Zn8介金屬相結構,而且隨著熱處理溫度上升,介金屬相顆粒變大,粒徑分布不一。
Sn-9Zn/Cu板試片於蟻酸氣氛下,在溫度為250℃、300℃時間為5分鐘和溫度為300℃時間為30分鐘浸漬熱處理後,界面處形成γ-Cu5Zn8介金屬相,隨著溫度與時間增加厚度增加。
URI: http://hdl.handle.net/11455/10016
Appears in Collections:材料科學與工程學系

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