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標題: 鋁鉻鉭鈦鋯多元高熵合金氮化物薄膜製備與擴散阻障性質之研究
Preparation and Diffusion Barrier Property of AlCrTaTiZr High-Entropy-Alloy Nitride Films
作者: Cheng, Ming-Ku
關鍵字: interconnect;內連線;diffusion barrier;AlCrTaTiZr;nitride;thermal stability;擴散阻障層;鋁鉻鉭鈦鋯;氮化物;熱穩定性
出版社: 材料科學與工程學系所
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To inhibit rapid Cu diffusion in interconnect structures, an effective diffusion barrier layer with high thermal stability, low electrical resistivity and good interface adhesion is demanded. Thus in this study, AlCrTaTiZr five-element high-entropy-alloy nitride films (HEAN) were deposited on silicon substrates by reactive radio-frequency magnetron sputtering. Thermal stability of the HEAN films and their barrier properties to Cu diffusion were investigated under thermal annealing at 700 to 900

在半導體銅內連線結構中,為了防止銅迅速地擴散進入元件內,須在介電層與銅導線間沉積一有效之擴散阻障層 (Diffusion Barrier Layer),且須具有高熱穩定性、低電阻係數、良好界面附著性等特性。因此本研究以射頻磁控濺鍍方法於矽基板上沉積 Al-Cr-Ta-Ti-Zr 五元高熵合金 (High-Entropy Alloy,簡稱 HEA) 及其氮化物 (HEA nitride,簡稱 HEAN) 薄膜,並評估其作為銅內連線擴散阻障層之可行性。在薄膜沉積時通入氮氣及氬氣,而氮氣流量與總氣體流量之比率 (RN) 分別設定為 0%、10%、30%,可分別得到高熵合金薄膜、高熵合金未飽和氮化物薄膜 (氮含量佔約 41%) 及高熵合金飽和氮化物薄膜 (氮含量佔約 50%),其五種金屬元素所佔比例約為等莫耳。擴散阻障性質上的分析結果發現,Si/HEAN (RN=0%)/Cu 疊層結構於 700℃ 退火後,開始出現 Cu3Si 結晶相且電阻率逐漸上升,顯示此 HEA 薄膜已失去擴散阻障能力。而 Si/HEAN (RN=10%)/Cu 疊層結構於 800℃ 退火後,Cu3Si 結晶相些微出現,電阻率亦逐漸上升,顯示此未飽和 HEAN 薄膜逐漸失去擴散阻障能力。而 Si/HEAN (RN=30%)/Cu 疊層結構於 900℃ 退火後,未出現任何反應析出相且電阻率維持在低值,顯示其具有相當優越之擴散阻障能力。
其他識別: U0005-2206200618112700
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