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標題: 於絕緣層覆矽基材製備鈷矽化物奈米線及其性質研究
Fabrication of cobalt silicide nanowires on SOI substrates and its properties
作者: 李旭正
Li, Hsu-Cheng
關鍵字: cobalt silicide;鈷矽化物;nanowires;Atomic force Microscopy;奈米線;原子力顯微鏡
出版社: 材料科學與工程學系所
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本實驗第一部份為利用原子力顯微鏡在絕緣層上覆矽基板上進行場致氧化,探討在不同環境濕度與偏壓下對於氧化線形態的影響;第二部分以絕緣層上覆矽基板製備鈷矽化物奈米線,利用原子力顯微鏡場致氧化微影製備矽奈米線,搭配兩種不同方法生成鈷矽化物:(1) 反應式磊晶法;(2) 固相反應法。探討此兩種方法生成鈷矽化物奈米線微結構、生成相及電性的差異。
操控成長鈷矽化物奈米線方面:400°C 及 600°C 反應式磊晶法所生成的鈷矽化物奈米線皆為非晶結構,700°C 反應式磊晶法生成多晶結構的 CoSi 奈米線,其奈米線有向兩側不規則成長的現象;400°C 固相反應形成的鈷矽化物奈米線為非晶的結構;而 600°C 固相反應則可形成多晶結構的 CoSi 奈米線;600°C 下生成的鈷矽化物奈米線由於生成矽化物的體積較多,所以電阻率低於 400°C 所生成的,反應式磊晶法生成的鈷矽化物奈米線相較於固相反應會有較大的最大電流密度值。

Cobalt silicide (CoSi2) nanowires has been widely used as gate electrodes, contacts and interconnects in nanoelectronic devices due to its line-width independent, low resistivity, high thermal stability and small lattice constant mismatch of 1.2% with silicon. Scanning probe lithography process is a low-cost and a simple method for fabricating nanometer-scale structures which can be applied to nanoelectronic devices.
The first part of this study, the effects of relative humidity and applied bias on nanometer-scale oxidation of silicon on insulator (SOI) substrates using AFM in contact mode were studied. In the second part, silicon nanowires were fabricated by wet etching of nano-oxidized SOI samples. Then, the silicon nanowires reacted with cobalt by a reactive deposition epitaxy or by a solid phase reaction to form cobalt silicide nanowires. The effects of reaction method and annealing temperature on the microstructures, phases and electrical properties of cobalt silicide nanowires were studied.
The results show as follows. The height and width of oxide nanowires formed by AFM nano-oxidation were increasing with the increase of the applied voltage. The oxidation rate was more sensitive to field strength at high relative humidity than that at low relative humidity. For high voltage, oxide height reached a saturation point, from where oxide height keeps a same value as the sample voltage increase.
For deposition reactive epitaxy, the cobalt silicide nanowires with amorphous structure were formed at 400°C and 600°C. A polycrystalline CoSi nanowire with lateral irregular growth formed at 700°C. For solid phase reaction, the cobalt silicide nanowires with amorphous structure were formed at 400°C. A polycrystalline CoSi nanowire formed at 600°C.
The resistivity of cobalt silicide nanowires formed at 600°C was lower than that formed at 400°C because the ratio of the volume of cobalt silicide to unreacted silicon was high for the nanowire formed at 600°C. The maximum current densities of cobalt silicide nanowires formed by a reactive deposition epitaxy were higher than that formed by a solid phase reaction.
其他識別: U0005-2408201120083600
Appears in Collections:材料科學與工程學系

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