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標題: 錫95/銻5無鉛焊料與熱處理之無電鍍鎳-磷/銅基材間的界面強度研究
Study on the shear strength of joints between the Sn95Sb5 solder and annealed Ni-P electroless-plated Cu substrate
作者: 林逸程
Lin, Yi-Cheng
關鍵字: Electroless Nickel;無電鍍鎳;annealing;Sn-Sb solder;shear test;退火;錫銻銲料;剪力推球測試
出版社: 材料科學與工程學系所
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本研究擬針對電子工業中常見的Cu/Ni-P基材進行不同退火條件後與Sn-5 wt%Sb接合之銲點強度進行探討。將Al2O3/Cu/Ni-P基板分別在300、350℃下進行退火,退火時間從15、30、60分鐘。將各條件之基板與Sn-5wt%Sb進行迴銲接合,迴銲時間從1、2、5、10、30到60分鐘。

In this research, it would be studied about the strength of solder joint which connected Sn-5wt%Sb alloy and Cu/Ni-P substrate annealed under different condition. The annealing temperature of Al2O3/Cu/Ni-P substrates are 300 and 350℃ separately together with annealing time of 15, 30, 60 minutes. Substrates under different annealing conditions are reflowed together with Sn-5wt%Sb alloy and the reflow periods are 1, 2, 5, 10, 30 and 60 minutes separately.
During reflow, Sn atoms in Sn-5wt%Sb alloy will react with Ni atoms in Cu/Ni-P substrates via the driving force of diffusion. By this reaction, one kind of intermetallic compound (IMC), Ni3Sn4 will occur at the interface between substrate and solder alloy. IMC will grow continuously with increasing period of reflow due to the diffusion of Ni3Sn4 into solder. The shearing test results show that the solder joint strength is positively related to reflow period and it is supposed that the IMC blocks the growth of crack.
After Cu/Ni-P substrates annealing, because of different coefficient of thermal expansion between Cu and Ni, the stress will break the surface of Ni-P layer. This phenomenon makes substrates unsteady and even broken after long time reflow although it could increase the solder joint strength. Shearing test results also show that the solder joint which made of substrates annealed at 300℃, 60 minutes and reflowed 1 minute has the highest shearing strength. It explains that by using proper annealed substrates, shearing strength of solder joint will increase, but if annealing temperature is too high or time is too long, the substrate may dissolve during reflow and it will lower the solder joint strength.
Appears in Collections:材料科學與工程學系

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