Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/1485
標題: 黏晶機創新改良之概念設計
Conceptual design of innovative improvement of die bonder
作者: 潘弘崧
關鍵字: TRIZ;黏晶機
出版社: 機械工程學系
摘要: 
i
IC黏晶為後段IC構裝製程中非常重要的製程之一,黏晶製程品質悠關整個構
裝製程能力,隨著構裝產品高密度的要求,黏晶品質愈來愈受嚴格的要求,再加
上現今對於電子產品的需求與日俱增,使得黏晶裝置的晶粒處理模組必須有較高
的速度才能符合現今的生產需求。有鑑於此,本論文之研究目的即為改善目前一
般黏晶機的缺點:提高黏晶品質-改善晶片在黏晶過程中的破裂情形與增加黏晶
速度-減少晶片在取放時所消耗的時間。
在本研究中,首先用功能分析法先將整個黏晶機系統作分析,並了解各個次
系統之功能,使得對整個系統有進一步的了解。接下來再利用創新設計法-TRIZ
來做系統的翻新設計,並進一步達到改良創新的目的。在本研究裡分別針對取放
頭、頂針機構與取放臂提出數個創新的機構概念設計,最後並利用機構模擬軟體
ADAMS模擬取放臂四個新構型的動態情形。

Die bond is a very important manufacturing process in IC package, the quality of
die bond relate to package manufacturing process. With the request of high density of
IC package product, the quality of die bond is more and more requested. And the
requirement of electrical products is steadily on the increase, the die bonder module
must have high speed to fit in with reqirement of production. So the research
objective of this thesis is to improve the disadvantage ordinary die bonder: improve
the die crack in die bonder and increase the speed of die bonder.
In this research, first of all, analysis the die bonder system with function analysis,
and to know the function of sub-system, then use innovative design method-TRIZ
to do a whole research for die bonder system. In the light of design steps of TRIZ,
bring up some conceptual design on pick and place head, the tip and pick and place
arm. Finally, we analysis pick and place arm with mechanism simulate software-
URI: http://hdl.handle.net/11455/1485
Appears in Collections:機械工程學系所

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