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Analysis of Heat Transfer in Three-Dimensional Rectangular Channel with Chips
|作者:||顏聰明||關鍵字:||rectangular channel;矩形渠道;forced convection;chip;PHOENICS;強制對流;晶片;PHOENICS||出版社:||機械工程學系||摘要:||
本文探討三維矩形渠道內發熱元件的熱傳問題，乃藉由計算流體力學(CFD)之套裝軟體『PHOENICS』來模擬發熱元件在不同的速度、配置方式及有無開孔時，其晶片溫度及紐賽數的分佈情形。數值計算方法乃利用有限差分法(Finite Difference Method)配合SIMPLE(Semi-Implicit Method with Pressure-Linked Equations)法則及混合體系法(Hybrid scheme)來求得統御方程式的穩態數值解。
It is very important to solve the problem of heat diffusion for electronic component in high technology today. For the electronic products, a higher temperature of chips will lose accuracy and the life of electronic component damage and cause the unsteadiness of the system.
This paper investigate the three-dimensional heat dissipating problem of the chips in the rectangular channel. The computational fluid code PHOENICS was used to simulate the distribution of temperature and the Nusselt number at various velocity and array. The finite difference method which associate SIMPLE algorithm and hybrid scheme was adopted as the numerical solution to governing equation.
From the computational results, the heat dissipation is better when the velocity is higher. The highest temperature is located in the center of chip. The effect of heat transfer is best at the front side of chip. The circulation appeared at the backside of chip so that the effect of heat transfer is not very good. If we make a hole behind the chips, it would improve the phenomenon of the circulation. In the vertical array, the effect of heat transfer will be better than the horizontal array because the interaction area between fluid and chip is larger.
Key words: rectangular channel, forced convection, chip, PHOENICS
|Appears in Collections:||機械工程學系所|
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