Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/1634
標題: 銲線機製程參數研究分析
Study of Parameters for Thermosonic Wire Bonder
作者: 林業超
CHAO, LIN YEH
關鍵字: 銲線機;金線結球;路徑成型;類神經網路;田口
出版社: 機械工程學系
摘要: 
銲線在半導體封裝中佔有舉足輕重的地位,影響銲線品質的因素有:銲接溫度、超音波功率、銲接力量、銲接時間金球大小、路徑長度及路徑高度等。對應於這些參數在銲線機製程之關鍵技術,可分為金線結球及銲線路徑穩定性兩個部分。
影響金線結球好壞的參數有:(1)線尾長度(2)鋼嘴型式(3)金線材質(4)放電產生器之電壓、電流、時間之大小長短(5)金線與電擊板的間隙大小(6)電擊板和鋼嘴的相對位置。
影響路徑穩定性的參數則有(1)FAB的熱影響區長度(2)一銲點Smash Ball大小及剪力強度(3)一、二銲點拉力強度(4)路徑轉折長度(5)路徑轉折角度(6)三軸同動之參數控制。
本文將針對銲線品質之影響參數進行探討,透過田口式實驗統計方法,來建立分析模式,並結合類神經網路,以找出最適之參數設定,做為製程參數最佳化及監控管理的依據,且期望能應用於設備開發與其它製程上。

Abstract
Wire bonding is a very important part in the semiconductor packaging, the parameters which affect the bonding quality includes:Bonding temperature、Ultrasonic power、Bonding force、Bonding time、Free air ball size、Loop Length and Loop Height etc. Considering these factors, the flowing two parts should be considered in the wire bonding process:Free air ball formation and Looping stability.
The parameters which affect the free air ball formation includes:(1)The tail length left after second bond(2)The type and shape of capillaries used(3)The material characteristics of gold wire(4)The supplied voltage, current and time of electrical flame-off (EFO)unit(5)The gap between tail and electrode plate(6)The relative position between capillary and electrode plate.
The parameters which affect the Loop stability includes:(1)Heat affect zone (HAZ) of Free Air Ball (FAB)(2)Smash ball size and shear force(3)Wire pull force(4)Loop reverse length(5)Loop reverse angle(6)Factors in the three axis motion.
In this paper, the study will focus on the effect of these parameters to the bonding quality, Taguchi Technique and neural network are applied in this study to establish the model and find the best parameters setting for wire bonding. It can then be used for wire bonding process parameter adjustment and process monitoring. It can also be used as reference for the development of equipment and other process
URI: http://hdl.handle.net/11455/1634
Appears in Collections:機械工程學系所

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