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標題: LED背光模組散熱鰭片之模擬與分析
Simulation and Analysis of Heat Dissipation Sink on LED Backlight
作者: 曾愷中
Tseng, Kai-Chung
關鍵字: LED;發光二極體;Backlight;CFD;Heat dissipation;背光模組;CFD;散熱
出版社: 機械工程學系所
引用: [1] R. J. VISSER, “Application of Polymer Light-Emitting Materials in Light-Emitting Diodes, Backlights and Displays”, Philips J. Res. 51, pp. 467-477, 1998 [2] G. Harbers, W. Timmers and W. S. Smitt,"LED Backlighting for LCD HDTV", Proc. 2nd Internation Display Manufacturing Conference, pp. 181-184, 2002 [3] R. S. West, H. Konijn, W. S. Smitt, S. Kuppens, N. Pfeffer, Y. Martynov, T. Yagi, S. Eberle, G. Harbers, T. W. Tan, C. E. Chan, ”High Brightness Direct LED Backlight for LCD-TV”, SID Intl Symp. Digest Tech Papers Book II, pp 1262-1265, 2003 [4] J. R.Culham and Yuri S. Muzychka, “Optimization of Plate Fin Heat Sinks Using Entropy Generation Minimization”, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 24, no. 2, pp. 159-165, JUNE 2001 [5] Chu, R. C., “Heat Transfer on Electronic System,” Proceeding of the 8th International Heat Transfer Conference, San Francisco, CA, pp. 36-42, 1986. [6] Nakayama, W., “Thermal Management of Electronic Equipment in advances in Thermal Modeling of Electronic Components and System”, Bar-Cohen, A., Eds., Hemisphere, Washington, DC, Vol. 1, pp. 1-78, 1988. [7] Morrison, A.T., “Optimization of Heat Sink Fin Geometries forHeat Sinks in Natural Convection”, Inter Society Conference on Thermal Phenomena, 1992. [8] Linton, R. L., and Agonafer, D., “Coarse and Detailed CFD Modelingof a Finned Heat Sink”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No. 3, pp.517-520.1995. [9] Meinders, E. R., and Hanjalic, K., “Vortex Structure and Heat transfer in Turbulent Flow over a Wall-Mounted Matrix of Cubes”, International Journal of Heat and Fluid Flow, Vol. 20, No. 2, pp.255-267, 1999. [10] Andrea, L. V., Stefano, G., and Franco, G., “Optimum Design of Vertical Rectangular Fin Arrays”, International Journal of Thermal Sciences, Vol. 38, No. 6, pp. 525-529, 1999. [11] J. A. Visser and D. j. de Kock, “Optimization of heat sink mass using the DYNAMIC-Q numerical optimization method”, Commun Numer. Meth. Enging, 18, pp.721-727, 2002. [12] 陳怡如, ”筆記型電腦CPU不等間距散熱片之最佳化設計”, 國立台灣科技大學碩士論文, pp.1-85, 2001. [13] 張志崴, ”高效率CPU散熱鰭片之ANSYS分析”, 國立海洋大學碩士論文, pp.1-72, 2002. [14] M. Arik, C. Becker, S. Weaver, and J. Petroski, “Thermal Management of LEDs: Package to System”, Proc. of SPIE Vol. 5187, P64-75, 2004. [15] Ken-ichi Takatori, “Field-sequential smectic LCD with twin-gate-TFT pixel amplifiers”, Displays, 25 pp. 37–44, 2004 [16] Rich Hicks, Wes Halstead. “Flat Fluorescent Lamp Technology for LCD’s”, IEEE, pp. 630-638, 1994 [17] [18]F. S. Tse, and I. E. Morse, “Measurement and Instrumentation in Engineering”, Marcel Dekker, Inc, 1989 [19] Bret A. Zahn, “Evaluating Thermal Characterization Accuracy Using CFD Codes – A Package Level Benchmark Study of IcePak™ and Flotherm®”, InterSociety Conference on Thermal Phenomena, pp.22-329, 1998. [20] Flotherm Reference Manual, Flomerics Ltd., Surrey, U.K. [21] 李季薇、韓斌、黃宏彥, “新世代大尺寸直下式LED背光模組之設計與模擬”, 國科會計畫NSC 94-2215-E-005-012, 2005. [22] 林益弘, “準系統電腦散熱流場模擬與分析 ”, 國立中興大學機械工程學系碩士論文, 2004。 [23] OPTO TECH CORPORATION FC-4040BL-B1-AA InGaN Flip Chip Blue LED原廠資料 [24] Flotherm Reference Manual, Flomerics Ltd., Surrey, U.K.
實驗結果發現交叉排列,鰭片底部厚度為5 mm、鰭片厚度2 mm、間距6 mm及鰭片高度16 mm時,縱向的單排模組可提供最佳的散熱結果,不僅可以提高24.86 %的效能,還可減少溫度差異,避免各排鰭片溫度不一致導致的色偏問題。
最後,藉由熱阻公式計算各結合點之溫度73.1 ℃,得知LED接合點最大容許溫度為120 ℃,因此本文所設計之鰭片模組符合安全需求。

This dissertation is for analysing sink parameters in High Power LED backlight, targeting at application for LCD. Because the stability and lifetime of a semiconductor element can be affected by long time usage or high temperature, the best design of sink was found by using several approaches. Firstly, this experiement measured temperature for sink on LED in a constant temperature environment. Then, CFD was used for simulation and analysis, considering four parameters, thickness of base, high of sink, thickness of sink and distance between sinks. After that, results from experiment and simulation were compared for verification. Finally, Taguchi Method was used for getting the best sink structure.
The experiment proved that with the following parameters, 5 mm base thickness, 2 mm sink thickness, 6 mm distance between sinks and 16 mm sink high, And crisscross design for single row sink. The best heat dissipation result can be provided. It does not only improve the efficient by 24.86 %, but also reduces The temperature difference. consequently, it avoid color washout problem which is caused by the temperature difference between different rows of sinks.
In conclusion, according to the result calculated by using heat resistant formular, the temperature for each junction is 73.1 ℃, and the maximum acceptable temperature for each LED junction is 120 ℃. Hence, the sink model designed in this thesis can meet safety requirement.
其他識別: U0005-2507200612222400
Appears in Collections:機械工程學系所

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