Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/1738
DC FieldValueLanguage
dc.contributor陳政雄zh_TW
dc.contributor蔡青益zh_TW
dc.contributor陳昭亮zh_TW
dc.contributor.advisor蔡志成zh_TW
dc.contributor.author王文聰zh_TW
dc.contributor.authorWang, Wen-Tsungen_US
dc.contributor.other中興大學zh_TW
dc.date2007zh_TW
dc.date.accessioned2014-06-05T11:41:32Z-
dc.date.available2014-06-05T11:41:32Z-
dc.identifierU0005-2708200623502500zh_TW
dc.identifier.citation[1] 經紀部市研組,“STN-LCD市場逐漸遭到侵蝕” ,統一證券集團投資週報, 民93。 [2] Sony Chemical Co., Ltd., Anisotropic Conductive Film, http://www.scc.sony.co.jp/html/products/detail/pdf/ACFforCOG¬_i.pdf. [3] J.-H. Jneg and T. E. Hsieh, “Application of Al/PI Composite Bumps to COG Bonding Process”, IEEE Transactions on Components and Packaging Technologies, Vol.24,No.2, June 2001, pp.271-278. [4] 謝宗雍,“電子構裝技術”,微電子材料與製程講義,第十章,http://pilot.mse.nthu.edu.tw/micro/chap10/。 [5] 徐嘉彬,劉俊賢,“熱超音波覆晶鍵合製程設備技術”,機械工業,258期,2004, pp. 218-228。 [6] 饒瑞年,異方性導電膜應用於COG製程之分析,國立中央大學機械工程研究所碩士論文,民89。 [7] 黃仁亮,製程參數對COG製程之影響分析,中華大學機械與航太工程研究所碩士論文,民90。 [8] 林義欽, 3μm異方性導電膠材之極精細顯示器構裝,國立中興大學機械工程研究所碩士論文,民93。 [9] Y. P. Wu, M. O Alarm, Y. C. Chen, B. Y. Wu, “Dynamic strength of conductive joints in flip chip on glass and flip chip on flex packages ”, Microelectronics Reliability 44(2003), 2003, pp.295-302 [10] M. J. Yim and K. W. Paik, “Design and Understanding of Anisotropic Conductive Films (ACF’s) for LCD Packaging”, IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A, Vol.21, No.2, June 1998, pp.226-234 [11] S. P. Timoshenko and J. N. Goodier, Theory of Elasticity, 3rd ed. McGraw-Hill, 1970, pp.409-414 [12] 張世明,壓縮式覆晶接合之內應力與接點阻抗關係研究,國立清華大學材料科學工程學系博士論文,民89。 [13] M. Chin, K. A. Iyer and S. J. Hu, “Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesive Assmblies”, IEEE Transaction on Components and Packaging Technologies, Vol.27, No.2, June 2004, pp.317-326 [14] 徐世昌,“蓮花的自潔功能與奈米科技的應用”,科學發展,2002年6月,354期,pp.60-63。 [15] C. Y. Yin, H. Lu, C. Bailey and Y. C. Chen, “Experimental and Modeling Analysis on Moisture Induced Failures in Flip Chip on Flex Interconnections with Anisotropic Conductive Film”, 2005 International Conference on Asian Green Electronics, 2005, pp.172-177 [16] S.-M. Chang, J-H Jou, A. Hsih, T.-H. Chen, C.-Y. Chang, Y.-H. Wang and C.-M. Huang, “Characteristic study of anisotropic-conductive film for chip-on-film packaging”, Microelectronics Reliability 41, 2001, pp.2001-2009 [17] C. Lee and A. Yeo, “Resistance Characterization of Flip Chip Joint Formed Using Au Bumps and Anisotropic Conductive Adhesiver”, 2003 Electronics Packaging Technology Conference, 2003, pp.369-375 [18] 福葆電子股份有限公司http://www.fupo.com.tw/Chinese/C_technology.asp。 [19] Hitachi Chemical Co., Ltd., “Anisotropic Conductive Film” http://www.hitachi-chem.co.jp/english/products/do/002.html. [20] A.W. Arthur原著,陶雨台譯,表面物理化學,千華出版公司,1988。zh_TW
dc.identifier.urihttp://hdl.handle.net/11455/1738-
dc.description.abstract本研究目的在於探討玻璃基板表面潔淨度對異方性導電膜在接合時的影響,經由特性要因分析找出三主要影響因子,先以此三因子設計三水準之全實驗來驗證其影響性,再以不同外在條件進行信賴性測試,測試外在環境改變對其導通阻抗之影響,實驗結果再透過變異數分析各因子之影響程度。經信賴性測試後的試片進一步投入進行推力測試,量測並分析其導通阻抗值之變化。 COG的接合是由接合壓力壓碎介於玻璃基材與IC間的ACF顆粒所達成,透過場發射掃描式電子顯微鏡觀察結果顯示,導電粒子在壓著的過程中產生變形或壓入金凸塊內兩種現象,而包覆在外的絕緣層、鍍金層及鍍鎳層破裂,在偏光顯微鏡下觀察,適度的壓力所產生的破裂對接合之導通效果會較佳。實驗結果顯示導通面積對導通阻抗影響度高達73.41%,研究所採用的異方性導電膜經實驗顯示較佳的導通面積需大或等於2000μm2,方可得一穩定導通阻抗。經信賴性測試後玻璃表面潔淨度(濕潤張力)越高其接合導通阻抗變化越少,表面潔淨度對信賴性測試所造成影響度達46%以上。由推力測試結果所示晶粒與異方性導電膜接合強度大於玻璃基板接合強度。zh_TW
dc.description.abstractIn this research the influence of surface condition of glass on electronic impedance of anisotropic conductive film (ACF) via chip-on-glass bonding process is investigate by experiments. Full experiments are designed and conducted at the first stage to investigate the effects of three effective factors, with three levels for each factor, selected from factor analysis. Samples from first stage are then sent to reliability tests at different environments to verify the stability of impedance. Influence of factors is evaluated by Analysis-of-Variance (ANOVA). Finally, a drag test was applied to ensure the bonding process. COG bonding is achieved via proper bonding pressure on the ACF particles between the glass substrate and the IC. Observation by microscopic showed that ACF particles are squeezed and crashed in the process. The conducting film on the outer surface is in firm contact with the glass substrate and with the chip bump to form the conducting channel. Experimental results showed that the effect of conducting area on the conducting impedance reaches 73.41%. The conducting area for the ACF used in the experiment must be higher than 2000μm2 to achieve stable conducting impedance. Reliability tests showed that the better surface cleanliness, tested by wetting tension, the more stable conducting impedance. The effect of surface cleanliness of glass substrate on the reliability test is over 46%. Results from the drag tests showed that the adherent strength of ACF conductive particle on gold bump is higher than that on glass substrate.en_US
dc.description.tableofcontents誌謝 i 摘要 ii ABSTRACT iii 符號表 iv 目次 v 表目次 vii 圖目次 viii 第一章 緒論 1 1.1平面顯示器構裝方式 2 1.2 研究動機與目標 7 1.3研究方法 8 1.4本文大綱 9 第二章 文獻回顧 11 2.1 ACF接合技術 11 2.2 ACF導通阻抗模型 13 2.2.1 ACF導通原理 13 2.2.2接觸力 14 2.2.3穿隧效應對接點阻抗之影響[12] 15 2.2.4導通阻抗數學模型比較 16 2.3表面接觸角[14] 19 第三章 實驗設計與製程規劃 23 3.1阻抗量測線路設計 23 3.1.1積體線路佈局 23 3.1.2測試基板線路佈局 25 3.2製程規劃 26 3.2.1相關材料製程及構裝流程 26 3.2.2相關材料條件 30 3.3製程參數 31 第四章 實驗結果與分析 36 4.1試片量測 36 4.1.1表面潔淨度量測數據 36 4.1.2 IC及玻璃特徵量測 39 4.2 導通阻抗值量測 42 4.3 信賴性量測 49 第五章 結論與討論 64 5.1結論 64 5.2討論 65 參考文獻 67zh_TW
dc.language.isoen_USzh_TW
dc.publisher機械工程學系所zh_TW
dc.relation.urihttp://www.airitilibrary.com/Publication/alDetailedMesh1?DocID=U0005-2708200623502500en_US
dc.subjectACFen_US
dc.subject異方性導電膜zh_TW
dc.subjectconduction resistanceen_US
dc.subjectsurface conditionen_US
dc.subjectwetting tensionen_US
dc.subject導通阻抗zh_TW
dc.subject表面潔淨度zh_TW
dc.subject濕潤張力zh_TW
dc.titleCOG構裝時玻璃表面潔淨度對異方性導電膜導通阻抗影響之實驗探討zh_TW
dc.titleAn Experimental Study on the Influence of Surface Condition of Glass on Electronic Impedance of Anisotropic Conductive Film via COG Processen_US
dc.typeThesis and Dissertationzh_TW
item.languageiso639-1en_US-
item.openairetypeThesis and Dissertation-
item.cerifentitytypePublications-
item.grantfulltextnone-
item.fulltextno fulltext-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
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