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標題: 脈衝式熱傳對壓焊刀頭斷面溫差之影響
Influence of pulse heat transfer for thermal difference of hot-bar on soldering process
作者: 吳昌哲
Wu, Chang-Che
關鍵字: hot bar;壓焊;uniform temperature;finite element analysis;均溫性;有限元素分析
出版社: 機械工程學系所
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In optoelectronics industry, there are various packaging interconnect technologies, such as hot bar process. The hot bar process uses to provide pulse current flow to instantly heat up the hot bar that is made by high resistance material, and then conducting the thermal to interconnect medium- lead free solder. In order to melt solder, the temperature of hot bar surface is much higher than solder melting point. Hence, the temperature consistency for the hot bar surface is very important; otherwise the over heating will damage the surface structure of soldering subject, which impacts directly the product reliability and life time.
This study focuses on overcoming thermal inconsistency on the two ends and the center of the hot bar during the soldering process. The huge temperature difference damages the soldering subject. For example, flexible printed circuit board surface substrate is burned after soldering process. In this work, we improve the temperature inconsistency of hot bar by way of changing the hot bar geometrical shape and the pulse current flow method. The current density and thermal conduction methods are utilized to study the temperature consistency of hot bar. The improved hot bar was actually tested, and the temperature of two ends and the center difference was under 5℃, which was consistent with the result of simulation. The surface of soldering subject substrate was not damaged or burned after soldering process. The improved hot bar had a consistency temperature and it met the requirement of the process.
其他識別: U0005-0602200910023300
Appears in Collections:機械工程學系所

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