Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/2057
標題: 手機外殼勾合強度研究
Study of Engagement Strength of Cell Phone Cover
作者: 林致孝
Lin, Chih-Hsiao
關鍵字: Cell Phone Cover;手機外殼;Snap;Drop Test;卡勾;掉落試驗
出版社: 機械工程學系所
引用: [1] CAE事業處結構分析部,“LS-DYNA應用於手機產品自由掉落測試分析報告,”勢流科技,2007 [2] 邱仕明,“物體墜落碰撞之有限元素應力分析,”華梵大學機電工程學系,專題研究成果報告,2005 [3] 陳旺志,“聰敏扣件之設計方法與研究,”國立成功大學機械工程學系,碩士論文,2005 [4] 南寧漢,黃智傑,“摺疊式行動電話LCD模組於掉落測試之有限元素分析,”明碁電通股份有限公司網通事業群,2004 [5] 黃崇忠,“利用掉落實驗與電腦模擬探討背光模組外殼的材質最佳化,”逢甲大學材料與製造工程學系,碩士論文,2007 [6] 黃鐳迪,“薄殼產品落地試驗之研究,”中原大學機械工程研究所,碩士論文,2003 [7] 陳伯群,“TFT-LCD掉落模擬分析及驗證研究,”國立中央大學機械工程研究所,碩士論文,2003 [8] 白金澤,“LS-DYNA 3D理論基礎與實例分析,”北京科學出版社,2005 [9] 康淵,陳信吉,“ANSYS入門,”全華科技圖書股份有限公司,2004 [10] Hun Shen Ng,Tong Yan Tee&Jing-en Luan,“Design for Standard Impact Pulses of Drop Tester using Dynamic Simulation,”Electronics Packaging Technology Conference,2004 [11] Tong Yan Tee,Jing-en Luan,Eric Pek,Chwee Teck Limb & Zhaowei Zhong,“Advanced Experimental and Simulation Techniques for Analysis of Dynamic Responses during Drop Impact,”Electronic Components and Technology Conference,2004 [12] Lim Chwee-Teck, Teo Y. M. and Shim V. P. W.,“Numerical Simulation of the Drop Impact Response of a Portable Electronic Product,”IEEE Transactions on Components and Packaging Technology,2002 [13] Low K.H.,Yang A.,Hoon K.H.,Zhang X.,Lim K.T.,“Initial Study on the Drop-Impact Behavior of Mini Hi-Fi Audio Products,”Advances in Engineering Software,2001 [14] Tim Spahr,“Snap-Fits for Assembly and Disassembly,” TICONA Engineering Polymers,1991 [15] Jason Wu,Guoshu Song,Chao-pin Yeh,Karl Wyatt,“Drop/ Impact Simulation and Test Validation of Telecommunication Products,”Applied Simulation and Modeling Research Motorola,1998 [16] Min-Chun Pan,Po-Chun Chen,Johnson Ho,“Drop Simulation and Experiment Validation of TFT-LCD Monitors,”Electronics Packaging Technology Conference,2003 [17] Mikrotron GmbH,“Digital Motion Analysis Recorder,” MotionBLITZ Cube,Instruction Manual Version 1.7.20
摘要: 
當手機掉落遭受重擊後,其外殼因受力的變形與破裂之重要性愈來越受到重視。本研究著重於分析手機外殼在受力後狀態研究,並提出結構設計的改善,進而增強其機構結合強度並提高其耐摔性。
經本研究結果發現,卡勾崁合功能是手機外殼結構設計的重點。運用卡勾結構實際設計經驗,利用Pro-E CAD繪圖軟體結合有限元素法LS-DYNA CAE的模擬分析,並配合高速攝影機對手機掉落方位詳細觀察,將其結果進行相互比對,以期在有限的外殼空間條件限制下,使得卡勾能達到設計預期的機構結合強度,同時賦予高的耐摔功能。
另外,透過本研究方法,可克服目前試驗人員普遍碰到掉落試驗結果之再現性不佳的困擾,藉此改善掉落試驗之盲點與模擬分析條件設定之錯誤,因此最終成效更具有其實際性與可信賴性。

The problem of deformation and fracture of the outer cover of cell phone incurred by external drop-off impact becomes more important than before. This thesis is focus on the analysis of the outer cover of cell phone after impact. Moreover, a modified structure is proposed to improve the strength of mechanism and the capability of anti-falling.
The insertion function of snap is one the most important factor of the outer cover structure design of cell phone. This research uses the simulation results by CAD software Pro-E and Finite Element software LS-DYNA to compare with the actual drop test of cell phone observed by high speed digital camera to prove computer simulation technique can be a useful method in the design of snap structure. Then we use design rules obtained by experience to modify the snap structure. The new design has successful overcome problems happened in old design.
A long existing problem of the drop test is the poor repeatability. A better design with shorter period can be achieved by using computer simulation technique and actual test.
URI: http://hdl.handle.net/11455/2057
其他識別: U0005-2008200809100400
Appears in Collections:機械工程學系所

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