Please use this identifier to cite or link to this item: `http://hdl.handle.net/11455/2273`
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dc.contributor.author廖惇孟zh_TW
dc.date2001zh_TW
dc.date.accessioned2014-06-05T11:42:51Z-
dc.date.available2014-06-05T11:42:51Z-
dc.identifier.urihttp://hdl.handle.net/11455/2273-
dc.description.abstract中文摘要 本文主要在研究積體電路的熱傳問題。藉由數值方法來模擬積體電路的熱傳行為，及電子電路與熱在IC晶片上的交互關係，經由數值模擬可以了解積體電路的溫度分布與溫度發展的情況。本研究利用三種方法來模擬，包括有限差分法、Fast Thermal Analysis (FTA)、及總熱阻模擬法。有限差分法是最常用的數值分析方法之一，好處是易於程式化。FTA是以Green’s function和error function為基礎所發展出來的方法。總熱阻模擬法則是運用熱傳計算和電阻估計所得的方法。數值模擬的參數包括封裝體材料的熱傳導係數、對大氣的熱對流係數，以及不同的物理模型。在本文中比較這些方法的差異及了解上述方法的優缺點。對於有限差分法，它是最通用且容易的方法，但是所需的計算時間太長。FTA可以快速地算出各元件的相對溫度，但是無法得到晶片的真實溫度。總熱阻模擬法則是一個可以快速算出晶片平均溫度的方法，而且還能維持有相當的準確度。由總熱阻模擬法求得之晶片溫度可用來補償FTA的結果而得到各元件的真實溫度。zh_TW
dc.description.abstractElectro-Thermal Simulation for Design of VLSI Circuits Dun-Meng Liao Department of Mechanical Engineering National Chung Hsing University, Taichung, Taiwan Abstract This study reports the results of the electro-thermal simulation for design of VLSI circuits. Three different approaches have been used to simulate the thermal and the electro-thermal effects on ICs, which are demonstrated in temperature distribution and temperature growth. The three approaches are the finite different method (FDM), the fast thermal analysis (FTA), and the thermal resistance method (TRM). The FDM, which is widely used in heat transfer calculations, basically serves as the benchmark of the simulation. The FTA, which is based on the Green's function and error function, provides fast estimation of the relative temperatures for all components of the circuit. The TRM, which treats the heat transfer occurring in the chip as in Ohm's law, offers a quick computation of the average temperature of the chip and the computational results may be utilized to compensate the relative values obtained with FTA. This study compares the simulation results calculated with each of the three methods. The comparison has also been made for parameters raging from the package material and modeling to the heat convection environment.en_US
dc.description.tableofcontents中文摘要………………………………………………………………I 英文摘要………………………………………………………………II 致謝…………………………………………………………………III 目錄……………………………………………………………………IV 圖目錄………………………………………………………………VI 表目錄…………………………………………………………………IX 第一章緒論…………………………………………………………1 1.1 研究背景……………………………………………………1 1.2 文獻回顧…………………………………………………….2 1.3 研究目的……………………………………………………3 第二章理論模式…………………………………………………4 2.1 物理模型……………………………………………………4 2.2 電路模型……………………………………………………6 2.3 統御方程式…………………………………………………7 第三章數值方法…………………………………………………9 3.1 有限差分法…………………………………………………9 3.2 Fast Thermal Analysis……………………………………15 3.3 總熱阻模擬法……………………………………………21 第四章結果與討論………………………………………………27 4.1 有限差分法結果…………………………………………27 4.1.1 穩態結果…………………………………………..27 4.1.2 暫態結果…………………………………………37 4.2 Fast Thermal Analysis結果………………………………47 4.3 總熱阻模擬法結果………………………………………51 第五章結論……………………………………………………….56 參考文獻………………………………………………………………58 附錄……………………………………………………………………..60zh_TW
dc.language.isoen_USzh_TW
dc.publisher機械工程學系zh_TW
dc.subject積體電路zh_TW
dc.subject有限差分法zh_TW
dc.subject熱阻zh_TW
dc.title積體電路設計之熱傳模擬zh_TW
dc.titleElectro-thermal simulation for design of VLSI circuitsen_US
dc.typeThesis and Dissertationzh_TW
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.openairetypeThesis and Dissertation-
item.cerifentitytypePublications-
item.fulltextno fulltext-
item.languageiso639-1en_US-
item.grantfulltextnone-
Appears in Collections:機械工程學系所

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